Changsup Ryu
Impact in
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- Copper Interconnects and Reliability
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- Semiconductor materials and devices
- Electronic Packaging and Soldering Technologies
- Electrodeposition and Electroless Coatings
- 3D IC and TSV technologies
Papers in
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- Semiconductor materials and devices 9
- Electronic Packaging and Soldering Technologies 8
- 3D IC and TSV technologies 4
- Integrated Circuits and Semiconductor Failure Analysis 3
- Ferroelectric and Negative Capacitance Devices 2
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- Copper Interconnects and Reliability 13
- Co-authors
- S.S. Wong (10 shared papers)Kee-Won Kwon (5 shared papers)Alvin L. S. Loke (5 shared papers)Robert Sinclair (2 shared papers)Hoo-Jeong Lee (1 shared paper)T. Nogami (2 shared papers)C. Patrick Yue (3 shared papers)Valery M. Dubin (2 shared papers)
- Journals
- Materials Chemistry and Physics (1 paper)Japanese Journal of Applied Physics (1 paper)IEEE Electron Device Letters (1 paper)IEEE Transactions on Device and Materials Reliability (1 paper)Applied Physics Letters (1 paper)
- Partner nations
- United StatesSouth KoreaJapan
In The Last Decade
Changsup Ryu
16 papers receiving 497 citations
Peers
Comparison fields: 5 of 36
- Electronic, Optical and Magnetic Materials 334
- Electrical and Electronic Engineering 413
- Mechanics of Materials 156
- Materials Chemistry 120
- Atomic and Molecular Physics, and Optics 80
Countries citing papers authored by Changsup Ryu
This map shows the geographic impact of Changsup Ryu's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Changsup Ryu with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Changsup Ryu more than expected).
Fields of papers citing papers by Changsup Ryu
This network shows the impact of papers produced by Changsup Ryu. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Changsup Ryu. The network helps show where Changsup Ryu may publish in the future.
Co-authors
The 21 scholars most cited alongside Changsup Ryu, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.
All Works
| # | Work | ||
|---|---|---|---|
| 1 | 1999 | 139 | |
| 2 | 1999 | 100 | |
| 3 | 1996 | 79 | |
| 4 | 1997 | 57 | |
| 5 | 1999 | 38 | |
| 6 | 2002 | 27 | |
| 7 | 1998 | 18 | |
| 8 | 2002 | 15 | |
| 9 | 2002 | 13 | |
| 10 | 2012 | 11 | |
| 11 | 1995 | 5 | |
| 12 | 2002 | 4 | |
| 13 | 2006 | 4 | |
| 14 | 2010 | 3 | |
| 15 | 1998 | 3 | |
| 16 | 2006 | 2 |
About Changsup Ryu
Changsup Ryu is a scholar working on Electrical and Electronic Engineering, Electronic, Optical and Magnetic Materials, Mechanics of Materials, Atomic and Molecular Physics, and Optics and Music, having authored 16 papers that have together received 518 indexed citations. Recurring topics across this work include Copper Interconnects and Reliability (13 papers), Semiconductor materials and devices (9 papers), Electronic Packaging and Soldering Technologies (8 papers), 3D IC and TSV technologies (4 papers), Metal and Thin Film Mechanics (3 papers), Integrated Circuits and Semiconductor Failure Analysis (3 papers), Ferroelectric and Negative Capacitance Devices (2 papers) and Semiconductor materials and interfaces (2 papers). The work is most often cited by research in Electronic, Optical and Magnetic Materials (334 citations), Electrical and Electronic Engineering (413 citations), Mechanics of Materials (156 citations), Materials Chemistry (120 citations) and Atomic and Molecular Physics, and Optics (80 citations). Changsup Ryu has collaborated with scholars based in United States, South Korea and Japan. Frequent co-authors include S.S. Wong, Kee-Won Kwon, Alvin L. S. Loke, Robert Sinclair, Hoo-Jeong Lee, T. Nogami, C. Patrick Yue, Valery M. Dubin, G.W. Ray and C. F. Quate. Their work appears in journals such as Materials Chemistry and Physics, Japanese Journal of Applied Physics, IEEE Electron Device Letters, IEEE Transactions on Device and Materials Reliability and Applied Physics Letters.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.