Kong Boon Yeap
Impact in
-
- Copper Interconnects and Reliability
Papers in
-
- Semiconductor materials and devices 20
- Integrated Circuits and Semiconductor Failure Analysis 11
- 3D IC and TSV technologies 4
- Electronic Packaging and Soldering Technologies 4
-
- Copper Interconnects and Reliability 17
- Co-authors
- Kaiyang Zeng (10 shared papers)Ehrenfried Zschech (13 shared papers)Dongzhi Chi (3 shared papers)Jing Zhu (2 shared papers)Patrick Justison (12 shared papers)Marco Sebastiani (2 shared papers)Alexander M. Korsunsky (2 shared papers)Edoardo Bemporad (2 shared papers)
- Journals
- Journal of Applied Physics (4 papers)Journal of materials research/Pratt's guide to venture capital sources (2 papers)The Philosophical Magazine A Journal of Theoretical Experimental and Applied Physics (2 papers)Thin Solid Films (2 papers)Microelectronic Engineering (2 papers)
- Partner nations
- United StatesGermanySingapore
In The Last Decade
Kong Boon Yeap
35 papers receiving 396 citations
Peers
Comparison fields: 5 of 36
- Electronic, Optical and Magnetic Materials 115
- Ceramics and Composites 31
- Mechanics of Materials 118
- Electrical and Electronic Engineering 243
- Mechanical Engineering 107
Countries citing papers authored by Kong Boon Yeap
This map shows the geographic impact of Kong Boon Yeap's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Kong Boon Yeap with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Kong Boon Yeap more than expected).
Fields of papers citing papers by Kong Boon Yeap
This network shows the impact of papers produced by Kong Boon Yeap. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Kong Boon Yeap. The network helps show where Kong Boon Yeap may publish in the future.
Co-authors
The 25 scholars most cited alongside Kong Boon Yeap, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.
All Works
Showing the 20 most-cited of 38 papers — load more, or switch the sort, to bring in the rest.
| # | Work | ||
|---|---|---|---|
| 1 | 2011 | 38 | |
| 2 | 2018 | 33 | |
| 3 | 2011 | 33 | |
| 4 | 2011 | 32 | |
| 5 | 2007 | 26 | |
| 6 | 2011 | 22 | |
| 7 | 2007 | 21 | |
| 8 | 2018 | 20 | |
| 9 | 2010 | 19 | |
| 10 | 2011 | 19 | |
| 11 | 2014 | 15 | |
| 12 | 2011 | 14 | |
| 13 | 2015 | 12 | |
| 14 | 2016 | 12 | |
| 15 | 2015 | 10 | |
| 16 | 2012 | 7 | |
| 17 | 2009 | 7 | |
| 18 | 2014 | 6 | |
| 19 | 2017 | 6 | |
| 20 | 2014 | 6 |
About Kong Boon Yeap
Kong Boon Yeap is a scholar working on Electrical and Electronic Engineering, Electronic, Optical and Magnetic Materials, Mechanics of Materials, Biomedical Engineering and Atomic and Molecular Physics, and Optics, having authored 38 papers that have together received 404 indexed citations. Recurring topics across this work include Semiconductor materials and devices (20 papers), Copper Interconnects and Reliability (17 papers), Metal and Thin Film Mechanics (16 papers), Advanced Surface Polishing Techniques (12 papers), Integrated Circuits and Semiconductor Failure Analysis (11 papers), 3D IC and TSV technologies (4 papers), Electronic Packaging and Soldering Technologies (4 papers) and Semiconductor materials and interfaces (3 papers). The work is most often cited by research in Electronic, Optical and Magnetic Materials (115 citations), Ceramics and Composites (31 citations), Mechanics of Materials (118 citations), Electrical and Electronic Engineering (243 citations) and Mechanical Engineering (107 citations). Kong Boon Yeap has collaborated with scholars based in United States, Germany and Singapore. Frequent co-authors include Kaiyang Zeng, Ehrenfried Zschech, Dongzhi Chi, Jing Zhu, Patrick Justison, Marco Sebastiani, Alexander M. Korsunsky, Edoardo Bemporad, Jonathan P.-H. Belnoue and Xu Song. Their work appears in journals such as Journal of Applied Physics, Journal of materials research/Pratt's guide to venture capital sources, The Philosophical Magazine A Journal of Theoretical Experimental and Applied Physics, Thin Solid Films and Microelectronic Engineering.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.