Chang-Chi Lee
Impact in
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- 3D IC and TSV technologies
- Electronic Packaging and Soldering Technologies
- Advancements in Semiconductor Devices and Circuit Design
- Low-power high-performance VLSI design
- Electromagnetic Compatibility and Noise Suppression
- Semiconductor materials and devices
- Hardware and Architecture top 10%
Papers in
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- Electronic Packaging and Soldering Technologies 19
- 3D IC and TSV technologies 17
- Silicon Carbide Semiconductor Technologies 5
- Electromagnetic Compatibility and Noise Suppression 4
- Integrated Circuits and Semiconductor Failure Analysis 2
- Advancements in Semiconductor Devices and Circuit Design 2
- Co-authors
- Tong Hong Wang (12 shared papers)Wei-Chih Chen (1 shared paper)Yi‐Shao Lai (10 shared papers)Cadmus Yuan (2 shared papers)Yu‐Hsiang Hsiao (3 shared papers)Bryan Black (2 shared papers)Michael Su (2 shared papers)Meng-Kai Shih (2 shared papers)
- Journals
- Microelectronics Reliability (3 papers)IEEE Access (2 papers)Microelectronic Engineering (2 papers)IEEE Transactions on Device and Materials Reliability (1 paper)Electronics (1 paper)
- Partner nations
- TaiwanUnited StatesAustralia
In The Last Decade
Chang-Chi Lee
25 papers receiving 381 citations
Peers
Comparison fields: 5 of 46
- Electrical and Electronic Engineering 333
- Hardware and Architecture 37
- Biomedical Engineering 133
- Computer Networks and Communications 64
- Automotive Engineering 22
Countries citing papers authored by Chang-Chi Lee
This map shows the geographic impact of Chang-Chi Lee's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Chang-Chi Lee with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Chang-Chi Lee more than expected).
Fields of papers citing papers by Chang-Chi Lee
This network shows the impact of papers produced by Chang-Chi Lee. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Chang-Chi Lee. The network helps show where Chang-Chi Lee may publish in the future.
Co-authors
The 25 scholars most cited alongside Chang-Chi Lee, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.
All Works
Showing the 20 most-cited of 28 papers — load more, or switch the sort, to bring in the rest.
| # | Work | ||
|---|---|---|---|
| 1 | 2016 | 112 | |
| 2 | 2017 | 93 | |
| 3 | 2020 | 26 | |
| 4 | 2020 | 25 | |
| 5 | 2008 | 17 | |
| 6 | 2010 | 17 | |
| 7 | 2016 | 17 | |
| 8 | 2012 | 15 | |
| 9 | 2012 | 12 | |
| 10 | 2011 | 9 | |
| 11 | 2005 | 7 | |
| 12 | 2013 | 6 | |
| 13 | 2019 | 6 | |
| 14 | 2006 | 4 | |
| 15 | 2017 | 4 | |
| 16 | 2014 | 4 | |
| 17 | 2014 | 3 | |
| 18 | 2007 | 3 | |
| 19 | 2019 | 3 | |
| 20 | 2019 | 3 |
About Chang-Chi Lee
Chang-Chi Lee is a scholar working on Electrical and Electronic Engineering, Biomedical Engineering, Materials Chemistry, Computer Networks and Communications and Electronic, Optical and Magnetic Materials, having authored 28 papers that have together received 395 indexed citations. Recurring topics across this work include Electronic Packaging and Soldering Technologies (19 papers), 3D IC and TSV technologies (17 papers), Silicon Carbide Semiconductor Technologies (5 papers), Electromagnetic Compatibility and Noise Suppression (4 papers), Thermal properties of materials (3 papers), Sensor Technology and Measurement Systems (2 papers), Integrated Circuits and Semiconductor Failure Analysis (2 papers) and Advancements in Semiconductor Devices and Circuit Design (2 papers). The work is most often cited by research in Electrical and Electronic Engineering (333 citations), Hardware and Architecture (37 citations), Biomedical Engineering (133 citations), Computer Networks and Communications (64 citations) and Automotive Engineering (22 citations). Chang-Chi Lee has collaborated with scholars based in Taiwan, United States and Australia. Frequent co-authors include Tong Hong Wang, Wei-Chih Chen, Yi‐Shao Lai, Cadmus Yuan, Yu‐Hsiang Hsiao, Bryan Black, Michael Su, Meng-Kai Shih, Ping‐Feng Yang and Chin‐Li Kao. Their work appears in journals such as Microelectronics Reliability, IEEE Access, Microelectronic Engineering, IEEE Transactions on Device and Materials Reliability and Electronics.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.