Dao-Long Chen
Impact in
- Mechanics of Materials top 10%
- Rock Mechanics and Modeling
- Metal and Thin Film Mechanics
- Mechanical Behavior of Composites
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- 3D IC and TSV technologies
- Electronic Packaging and Soldering Technologies
- Integrated Circuits and Semiconductor Failure Analysis
Papers in
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- Electronic Packaging and Soldering Technologies 28
- 3D IC and TSV technologies 25
- Electromagnetic Compatibility and Noise Suppression 6
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- Mechanical Behavior of Composites 6
- Metal and Thin Film Mechanics 5
- Material Properties and Processing 4
- Co-authors
- Ping‐Feng Yang (4 shared papers)Yi‐Shao Lai (2 shared papers)Meng-Kai Shih (9 shared papers)C.-P Hung (9 shared papers)Xiling Liu (2 shared papers)Wei He (1 shared paper)David Tarng (16 shared papers)Chin‐Li Kao (6 shared papers)
- Journals
- Mathematics and Mechanics of Solids (4 papers)Microelectronics Reliability (4 papers)IEEE Transactions on Components Packaging and Manufacturing Technology (3 papers)IEEE Transactions on Device and Materials Reliability (2 papers)Engineering With Computers (1 paper)
- Partner nations
- TaiwanNew ZealandChina
In The Last Decade
Dao-Long Chen
50 papers receiving 535 citations
Peers
Comparison fields: 5 of 66
- Mechanics of Materials 178
- Electrical and Electronic Engineering 285
- Hardware and Architecture 33
- Fluid Flow and Transfer Processes 24
- Mechanical Engineering 85
Countries citing papers authored by Dao-Long Chen
This map shows the geographic impact of Dao-Long Chen's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Dao-Long Chen with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Dao-Long Chen more than expected).
Fields of papers citing papers by Dao-Long Chen
This network shows the impact of papers produced by Dao-Long Chen. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Dao-Long Chen. The network helps show where Dao-Long Chen may publish in the future.
Co-authors
The 25 scholars most cited alongside Dao-Long Chen, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.
All Works
Showing the 20 most-cited of 55 papers — load more, or switch the sort, to bring in the rest.
| # | Work | ||
|---|---|---|---|
| 1 | 2016 | 112 | |
| 2 | 2020 | 59 | |
| 3 | 2011 | 53 | |
| 4 | 2005 | 42 | |
| 5 | 2014 | 28 | |
| 6 | 2022 | 21 | |
| 7 | 2004 | 15 | |
| 8 | 2014 | 14 | |
| 9 | 2019 | 12 | |
| 10 | 2020 | 12 | |
| 11 | 1996 | 11 | |
| 12 | 2012 | 10 | |
| 13 | 1986 | 10 | |
| 14 | 2015 | 9 | |
| 15 | 2014 | 9 | |
| 16 | 2022 | 8 | |
| 17 | 2019 | 8 | |
| 18 | 2018 | 8 | |
| 19 | 2021 | 7 | |
| 20 | 2024 | 7 |
About Dao-Long Chen
Dao-Long Chen is a scholar working on Electrical and Electronic Engineering, Mechanics of Materials, Mechanical Engineering, Biomedical Engineering and Materials Chemistry, having authored 55 papers that have together received 561 indexed citations. Recurring topics across this work include Electronic Packaging and Soldering Technologies (28 papers), 3D IC and TSV technologies (25 papers), Mechanical Behavior of Composites (6 papers), Electromagnetic Compatibility and Noise Suppression (6 papers), Metal and Thin Film Mechanics (5 papers), Advanced Surface Polishing Techniques (4 papers), Material Properties and Processing (4 papers) and Synthesis and properties of polymers (3 papers). The work is most often cited by research in Mechanics of Materials (178 citations), Electrical and Electronic Engineering (285 citations), Hardware and Architecture (33 citations), Fluid Flow and Transfer Processes (24 citations) and Mechanical Engineering (85 citations). Dao-Long Chen has collaborated with scholars based in Taiwan, New Zealand and China. Frequent co-authors include Ping‐Feng Yang, Yi‐Shao Lai, Meng-Kai Shih, C.-P Hung, Xiling Liu, Wei He, David Tarng, Chin‐Li Kao, Tz-Cheng Chiu and Yi-Shao Lai. Their work appears in journals such as Mathematics and Mechanics of Solids, Microelectronics Reliability, IEEE Transactions on Components Packaging and Manufacturing Technology, IEEE Transactions on Device and Materials Reliability and Engineering With Computers.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.