Debendra Mallik

4 papers and 66 indexed citations i.

Debendra Mallik is a scholar working on Electrical and Electronic Engineering, Mechanical Engineering and Management of Technology and Innovation. According to data from OpenAlex, Debendra Mallik has authored 4 papers receiving a total of 66 indexed citations (citations by other indexed papers that have themselves been cited), including 4 papers in Electrical and Electronic Engineering, 1 paper in Mechanical Engineering and 1 paper in Management of Technology and Innovation. Recurrent topics in Debendra Mallik’s work include 3D IC and TSV technologies (3 papers), Electronic Packaging and Soldering Technologies (3 papers) and VLSI and FPGA Design Techniques (1 paper). Debendra Mallik is often cited by papers focused on 3D IC and TSV technologies (3 papers), Electronic Packaging and Soldering Technologies (3 papers) and VLSI and FPGA Design Techniques (1 paper). Debendra Mallik collaborates with scholars based in United States. Debendra Mallik's co-authors include Somnath Paul, Tao Wang, James Tschanz, Ryan Kim, Vivek De, Robert Sankman, Sriram Vangal, Paolo Aseron, Ravi Mahajan and John Tang and has published in prestigious journals such as IEEE Journal of Solid-State Circuits, MRS Bulletin and IEEE Transactions on Components Hybrids and Manufacturing Technology.