Tong Hong Wang

36 papers and 410 indexed citations i.

Tong Hong Wang has authored 36 papers that have received a total of 410 indexed citations. This includes 24 papers in Electrical and Electronic Engineering, 12 papers in Materials Chemistry and 8 papers in Biomedical Engineering. The topics of these papers are Electronic Packaging and Soldering Technologies (21 papers), 3D IC and TSV technologies (16 papers) and Chemical Mechanical Polishing in Microelectronics Manufacturing (6 papers). Tong Hong Wang is often cited by papers focused on Electronic Packaging and Soldering Technologies (21 papers), 3D IC and TSV technologies (16 papers) and Chemical Mechanical Polishing in Microelectronics Manufacturing (6 papers) and collaborates with scholars based in Taiwan and United States. Tong Hong Wang's co-authors include Yi‐Shao Lai, Te‐Hua Fang, Chang-Chi Lee, Shao-Hui Kang and Yu-Cheng Lin and has published in prestigious journals such as Materials Science and Engineering A, Journal of Materials Science and Nanotechnology.