Ping‐Feng Yang
Impact in
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- Electronic Packaging and Soldering Technologies
- 3D IC and TSV technologies
- Fuel Cells and Related Materials
- Mechanics of Materials top 5%
- Metal and Thin Film Mechanics
Papers in
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- Metal and Thin Film Mechanics 16
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- Electronic Packaging and Soldering Technologies 21
- 3D IC and TSV technologies 12
- Co-authors
- Yi‐Shao Lai (20 shared papers)Sheng‐Rui Jian (13 shared papers)Chang-Lin Yeh (1 shared paper)Rongsheng Chen (6 shared papers)Jiunn Chen (6 shared papers)Dao-Long Chen (4 shared papers)Hexing Li (1 shared paper)Hui Li (1 shared paper)
In The Last Decade
Ping‐Feng Yang
43 papers receiving 1.0k citations
Peers
Comparison fields: 5 of 74
- Electrical and Electronic Engineering 738
- Mechanics of Materials 237
- Mechanical Engineering 323
- Materials Chemistry 286
- General Materials Science 19
Countries citing papers authored by Ping‐Feng Yang
This map shows the geographic impact of Ping‐Feng Yang's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Ping‐Feng Yang with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Ping‐Feng Yang more than expected).
Fields of papers citing papers by Ping‐Feng Yang
This network shows the impact of papers produced by Ping‐Feng Yang. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Ping‐Feng Yang. The network helps show where Ping‐Feng Yang may publish in the future.
Co-authors
The 25 scholars most cited alongside Ping‐Feng Yang, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.
All Works
Showing the 20 most-cited of 45 papers — load more, or switch the sort, to bring in the rest.
| # | Work | ||
|---|---|---|---|
| 1 | 2005 | 147 | |
| 2 | 2007 | 146 | |
| 3 | 2016 | 117 | |
| 4 | 2007 | 91 | |
| 5 | 2016 | 77 | |
| 6 | 2016 | 61 | |
| 7 | 2007 | 57 | |
| 8 | 2011 | 56 | |
| 9 | 2008 | 45 | |
| 10 | 2008 | 40 | |
| 11 | 2014 | 31 | |
| 12 | 2013 | 30 | |
| 13 | 2009 | 30 | |
| 14 | 2016 | 15 | |
| 15 | 2007 | 14 | |
| 16 | 2016 | 12 | |
| 17 | 2011 | 12 | |
| 18 | 2014 | 12 | |
| 19 | 2024 | 8 | |
| 20 | 2009 | 8 |
About Ping‐Feng Yang
Ping‐Feng Yang is a scholar working on Mechanics of Materials, Electrical and Electronic Engineering, Materials Chemistry, Mechanical Engineering and Condensed Matter Physics, having authored 45 papers that have together received 1.1k indexed citations. Recurring topics across this work include Electronic Packaging and Soldering Technologies (21 papers), Metal and Thin Film Mechanics (16 papers), 3D IC and TSV technologies (12 papers), Diamond and Carbon-based Materials Research (7 papers), Advanced Surface Polishing Techniques (6 papers), Copper Interconnects and Reliability (4 papers), Advanced Welding Techniques Analysis (4 papers) and GaN-based semiconductor devices and materials (4 papers). The work is most often cited by research in Electrical and Electronic Engineering (738 citations), Mechanics of Materials (237 citations), Mechanical Engineering (323 citations), Materials Chemistry (286 citations) and General Materials Science (19 citations). Ping‐Feng Yang has collaborated with scholars based in Taiwan, India and China. Frequent co-authors include Yi‐Shao Lai, Sheng‐Rui Jian, Chang-Lin Yeh, Rongsheng Chen, Jiunn Chen, Dao-Long Chen, Hexing Li, Hui Li, Chin‐Li Kao and Wei‐Hong Lai. Their work appears in journals such as Microelectronics Reliability, Materials Science and Engineering A, Applied Surface Science, Journal of Alloys and Compounds and Nanoscale Research Letters.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.