Chen-Chao Wang
Impact in
- Pharmaceutical Science top 5%
-
- 3D IC and TSV technologies
- Microwave Engineering and Waveguides
- Electronic Packaging and Soldering Technologies
- Electromagnetic Compatibility and Noise Suppression
Papers in
-
- 3D IC and TSV technologies 57
- Electromagnetic Compatibility and Noise Suppression 44
- Electronic Packaging and Soldering Technologies 40
- Microwave Engineering and Waveguides 34
- Radio Frequency Integrated Circuit Design 14
- Millimeter-Wave Propagation and Modeling 14
-
- Antenna Design and Analysis 13
- Co-authors
- Chih-Pin Hung (25 shared papers)Hung-Hsiang Cheng (20 shared papers)Henry L. Surprenant (1 shared paper)Donald C. Monkhouse (1 shared paper)A. Waseem Malick (2 shared papers)James W. McGinity (2 shared papers)Navnit H. Shah (2 shared papers)Martin H. Infeld (2 shared papers)
- Journals
- IEEE Transactions on Components Packaging and Manufacturing Technology (6 papers)IEEE Transactions on Advanced Packaging (2 papers)The International Journal of Advanced Manufacturing Technology (1 paper)International Journal of Pharmaceutics (1 paper)Materials Science in Semiconductor Processing (1 paper)
- Partner nations
- TaiwanUnited StatesChina
In The Last Decade
Chen-Chao Wang
113 papers receiving 688 citations
Peers
Comparison fields: 5 of 82
- Pharmaceutical Science 62
- Electrical and Electronic Engineering 476
- Automotive Engineering 86
- Aerospace Engineering 144
- Hardware and Architecture 24
Countries citing papers authored by Chen-Chao Wang
This map shows the geographic impact of Chen-Chao Wang's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Chen-Chao Wang with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Chen-Chao Wang more than expected).
Fields of papers citing papers by Chen-Chao Wang
This network shows the impact of papers produced by Chen-Chao Wang. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Chen-Chao Wang. The network helps show where Chen-Chao Wang may publish in the future.
Co-authors
The 25 scholars most cited alongside Chen-Chao Wang, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.
All Works
Showing the 20 most-cited of 134 papers — load more, or switch the sort, to bring in the rest.
| # | Work | ||
|---|---|---|---|
| 1 | 2006 | 86 | |
| 2 | 1997 | 45 | |
| 3 | Cross-talk between TGF-β/Smad pathway and Wnt/β-catenin pathway in pathological scar formation. | 2015 | 36 |
| 4 | 2019 | 28 | |
| 5 | 2018 | 26 | |
| 6 | 2019 | 25 | |
| 7 | 2011 | 23 | |
| 8 | 1996 | 16 | |
| 9 | 2018 | 16 | |
| 10 | 2011 | 16 | |
| 11 | 2008 | 15 | |
| 12 | 2011 | 15 | |
| 13 | 2022 | 14 | |
| 14 | 2018 | 14 | |
| 15 | 2017 | 14 | |
| 16 | 2019 | 14 | |
| 17 | 1997 | 12 | |
| 18 | 2019 | 12 | |
| 19 | 2020 | 11 | |
| 20 | 2018 | 10 |
About Chen-Chao Wang
Chen-Chao Wang is a scholar working on Electrical and Electronic Engineering, Aerospace Engineering, Biomedical Engineering, Hardware and Architecture and Mechanical Engineering, having authored 134 papers that have together received 736 indexed citations. Recurring topics across this work include 3D IC and TSV technologies (57 papers), Electromagnetic Compatibility and Noise Suppression (44 papers), Electronic Packaging and Soldering Technologies (40 papers), Microwave Engineering and Waveguides (34 papers), Radio Frequency Integrated Circuit Design (14 papers), Millimeter-Wave Propagation and Modeling (14 papers), Antenna Design and Analysis (13 papers) and VLSI and Analog Circuit Testing (8 papers). The work is most often cited by research in Pharmaceutical Science (62 citations), Electrical and Electronic Engineering (476 citations), Automotive Engineering (86 citations), Aerospace Engineering (144 citations) and Hardware and Architecture (24 citations). Chen-Chao Wang has collaborated with scholars based in Taiwan, United States and China. Frequent co-authors include Chih-Pin Hung, Hung-Hsiang Cheng, Henry L. Surprenant, Donald C. Monkhouse, A. Waseem Malick, James W. McGinity, Navnit H. Shah, Martin H. Infeld, David Tarng and Tzyy‐Sheng Horng. Their work appears in journals such as IEEE Transactions on Components Packaging and Manufacturing Technology, IEEE Transactions on Advanced Packaging, The International Journal of Advanced Manufacturing Technology, International Journal of Pharmaceutics and Materials Science in Semiconductor Processing.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.