C.-P Hung
Impact in
- Hardware and Architecture top 10%
-
- 3D IC and TSV technologies
- Electronic Packaging and Soldering Technologies
- Electromagnetic Compatibility and Noise Suppression
- Radio Frequency Integrated Circuit Design
- Microwave Engineering and Waveguides
- Integrated Circuits and Semiconductor Failure Analysis
Papers in
-
- Electronic Packaging and Soldering Technologies 32
- 3D IC and TSV technologies 30
- Electromagnetic Compatibility and Noise Suppression 16
- Radio Frequency Integrated Circuit Design 7
- Microwave Engineering and Waveguides 5
- Advanced Power Amplifier Design 4
- Integrated Circuits and Semiconductor Failure Analysis 4
-
- Heat Transfer and Optimization 4
- Co-authors
- Meng-Kai Shih (19 shared papers)David Tarng (20 shared papers)Dao-Long Chen (9 shared papers)Wei‐Hong Lai (6 shared papers)Tzyy‐Sheng Horng (11 shared papers)Shujing Wu (9 shared papers)Chin‐Li Kao (5 shared papers)Karen Chen (2 shared papers)
- Journals
- IEEE Transactions on Components Packaging and Manufacturing Technology (5 papers)Computers & Industrial Engineering (1 paper)IEEE Transactions on Advanced Packaging (1 paper)Electronics Letters (1 paper)Materials (1 paper)
- Partner nations
- TaiwanUnited States
In The Last Decade
C.-P Hung
43 papers receiving 354 citations
Peers
Comparison fields: 5 of 36
- Hardware and Architecture 41
- Electrical and Electronic Engineering 321
- Automotive Engineering 25
- Electronic, Optical and Magnetic Materials 24
- Biomedical Engineering 47
Countries citing papers authored by C.-P Hung
This map shows the geographic impact of C.-P Hung's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by C.-P Hung with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites C.-P Hung more than expected).
Fields of papers citing papers by C.-P Hung
This network shows the impact of papers produced by C.-P Hung. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by C.-P Hung. The network helps show where C.-P Hung may publish in the future.
Co-authors
The 25 scholars most cited alongside C.-P Hung, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.
All Works
Showing the 20 most-cited of 51 papers — load more, or switch the sort, to bring in the rest.
| # | Work | ||
|---|---|---|---|
| 1 | 2016 | 104 | |
| 2 | 2020 | 27 | |
| 3 | 2021 | 25 | |
| 4 | 2019 | 25 | |
| 5 | 2022 | 18 | |
| 6 | 2004 | 18 | |
| 7 | 2022 | 11 | |
| 8 | 2017 | 10 | |
| 9 | 2004 | 9 | |
| 10 | 2002 | 8 | |
| 11 | 2017 | 8 | |
| 12 | 2005 | 8 | |
| 13 | 2022 | 7 | |
| 14 | 2009 | 6 | |
| 15 | 2022 | 6 | |
| 16 | 2014 | 6 | |
| 17 | 2019 | 6 | |
| 18 | 2002 | 6 | |
| 19 | 2017 | 5 | |
| 20 | 2018 | 5 |
About C.-P Hung
C.-P Hung is a scholar working on Electrical and Electronic Engineering, Mechanical Engineering, Biomedical Engineering, Mechanics of Materials and Hardware and Architecture, having authored 51 papers that have together received 375 indexed citations. Recurring topics across this work include Electronic Packaging and Soldering Technologies (32 papers), 3D IC and TSV technologies (30 papers), Electromagnetic Compatibility and Noise Suppression (16 papers), Radio Frequency Integrated Circuit Design (7 papers), Microwave Engineering and Waveguides (5 papers), Advanced Power Amplifier Design (4 papers), Integrated Circuits and Semiconductor Failure Analysis (4 papers) and Heat Transfer and Optimization (4 papers). The work is most often cited by research in Hardware and Architecture (41 citations), Electrical and Electronic Engineering (321 citations), Automotive Engineering (25 citations), Electronic, Optical and Magnetic Materials (24 citations) and Biomedical Engineering (47 citations). C.-P Hung has collaborated with scholars based in Taiwan and United States. Frequent co-authors include Meng-Kai Shih, David Tarng, Dao-Long Chen, Wei‐Hong Lai, Tzyy‐Sheng Horng, Shujing Wu, Chin‐Li Kao, Karen Chen, Li-Chieh Chen and Ping‐Feng Yang. Their work appears in journals such as IEEE Transactions on Components Packaging and Manufacturing Technology, Computers & Industrial Engineering, IEEE Transactions on Advanced Packaging, Electronics Letters and Materials.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.