M. McAllister
Impact in
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- Electromagnetic Compatibility and Noise Suppression
- 3D IC and TSV technologies
- Low-power high-performance VLSI design
- Electrostatic Discharge in Electronics
- Electronic Packaging and Soldering Technologies
- Electromagnetic Simulation and Numerical Methods
- Microwave Engineering and Waveguides
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- Lightning and Electromagnetic Phenomena
Papers in
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- Electromagnetic Compatibility and Noise Suppression 10
- Electrostatic Discharge in Electronics 5
- 3D IC and TSV technologies 4
- Low-power high-performance VLSI design 4
- Electronic Packaging and Soldering Technologies 2
- VLSI and FPGA Design Techniques 1
- Co-authors
- W. T. Weeks (1 shared paper)Arvind Singh (1 shared paper)Dale Becker (5 shared papers)T. G. McNamara (2 shared papers)Paul Muench (2 shared papers)H. Smith (2 shared papers)S. Richter (2 shared papers)G. Katopis (3 shared papers)
- Journals
- IEEE Transactions on Advanced Packaging (2 papers)IBM Journal of Research and Development (1 paper)IEEE Transactions on Components Packaging and Manufacturing Technology Part B (2 papers)Canadian Conference on Computational Geometry (1 paper)The HKU Scholars Hub (University of Hong Kong) (2 papers)
- Partner nations
- United StatesGermany
In The Last Decade
M. McAllister
12 papers receiving 389 citations
Peers
Comparison fields: 5 of 31
- Electrical and Electronic Engineering 384
- Astronomy and Astrophysics 42
- Hardware and Architecture 14
- Aerospace Engineering 46
- Condensed Matter Physics 19
Countries citing papers authored by M. McAllister
This map shows the geographic impact of M. McAllister's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by M. McAllister with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites M. McAllister more than expected).
Fields of papers citing papers by M. McAllister
This network shows the impact of papers produced by M. McAllister. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by M. McAllister. The network helps show where M. McAllister may publish in the future.
Co-authors
The 23 scholars most cited alongside M. McAllister, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.
All Works
| # | Work | ||
|---|---|---|---|
| 1 | 1979 | 227 | |
| 2 | 1998 | 69 | |
| 3 | 2002 | 30 | |
| 4 | 1994 | 25 | |
| 5 | 2009 | 17 | |
| 6 | 2002 | 16 | |
| 7 | 2001 | 14 | |
| 8 | 2002 | 8 | |
| 9 | 2002 | 6 | |
| 10 | 2009 | 6 | |
| 11 | Two-dimensional Computation of the Three-dimensional Reachable Region for a Welding Head. | 1993 | 4 |
| 12 | 2002 | 4 |
About M. McAllister
M. McAllister is a scholar working on Electrical and Electronic Engineering, Computer Networks and Communications, Astronomy and Astrophysics, Mechanics of Materials and Computational Mechanics, having authored 12 papers that have together received 426 indexed citations. Recurring topics across this work include Electromagnetic Compatibility and Noise Suppression (10 papers), Electrostatic Discharge in Electronics (5 papers), 3D IC and TSV technologies (4 papers), Low-power high-performance VLSI design (4 papers), Electronic Packaging and Soldering Technologies (2 papers), VLSI and FPGA Design Techniques (1 paper), Embedded Systems Design Techniques (1 paper) and Advanced Theoretical and Applied Studies in Material Sciences and Geometry (1 paper). The work is most often cited by research in Electrical and Electronic Engineering (384 citations), Astronomy and Astrophysics (42 citations), Hardware and Architecture (14 citations), Aerospace Engineering (46 citations) and Condensed Matter Physics (19 citations). M. McAllister has collaborated with scholars based in United States and Germany. Frequent co-authors include W. T. Weeks, Arvind Singh, Dale Becker, T. G. McNamara, Paul Muench, H. Smith, S. Richter, G. Katopis, Madhavan Swaminathan and A. Deutsch. Their work appears in journals such as IEEE Transactions on Advanced Packaging, IBM Journal of Research and Development, IEEE Transactions on Components Packaging and Manufacturing Technology Part B, Canadian Conference on Computational Geometry and The HKU Scholars Hub (University of Hong Kong).
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.