T.C. Chai
Impact in
-
- 3D IC and TSV technologies
- Electronic Packaging and Soldering Technologies
- Integrated Circuits and Semiconductor Failure Analysis
- Semiconductor materials and devices
- Automotive Engineering top 5%
- Additive Manufacturing and 3D Printing Technologies
Papers in
-
- Electronic Packaging and Soldering Technologies 39
- 3D IC and TSV technologies 34
- Integrated Circuits and Semiconductor Failure Analysis 6
- Electromagnetic Compatibility and Noise Suppression 5
-
- Material Properties and Processing 6
- Metal and Thin Film Mechanics 3
- Co-authors
- Xiaowu Zhang (23 shared papers)John H. Lau (8 shared papers)Cheryl Selvanayagam (4 shared papers)Kripesh Vaidyanathan (2 shared papers)S. Seah (1 shared paper)V. Kripesh (7 shared papers)E.B. Liao (2 shared papers)Navas Khan (2 shared papers)
- Journals
- Journal of Electronic Materials (2 papers)Microelectronics Reliability (2 papers)IEEE Transactions on Advanced Packaging (1 paper)IEEE Transactions on Components Packaging and Manufacturing Technology (1 paper)IEEE Transactions on Device and Materials Reliability (1 paper)
- Partner nations
- SingaporeUnited StatesHong Kong
In The Last Decade
T.C. Chai
40 papers receiving 822 citations
Peers
Comparison fields: 5 of 34
- Electrical and Electronic Engineering 820
- Automotive Engineering 141
- Electronic, Optical and Magnetic Materials 99
- Mechanics of Materials 94
- Biomedical Engineering 144
Countries citing papers authored by T.C. Chai
This map shows the geographic impact of T.C. Chai's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by T.C. Chai with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites T.C. Chai more than expected).
Fields of papers citing papers by T.C. Chai
This network shows the impact of papers produced by T.C. Chai. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by T.C. Chai. The network helps show where T.C. Chai may publish in the future.
Co-authors
The 25 scholars most cited alongside T.C. Chai, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.
All Works
Showing the 20 most-cited of 43 papers — load more, or switch the sort, to bring in the rest.
| # | Work | ||
|---|---|---|---|
| 1 | 2009 | 219 | |
| 2 | 2010 | 95 | |
| 3 | 2009 | 90 | |
| 4 | 2008 | 80 | |
| 5 | 2008 | 66 | |
| 6 | 2010 | 59 | |
| 7 | 2005 | 39 | |
| 8 | 2004 | 29 | |
| 9 | 2011 | 20 | |
| 10 | 2002 | 17 | |
| 11 | 2011 | 15 | |
| 12 | 2005 | 15 | |
| 13 | 2007 | 13 | |
| 14 | 2008 | 11 | |
| 15 | 2014 | 10 | |
| 16 | 2008 | 8 | |
| 17 | 2002 | 8 | |
| 18 | 2006 | 7 | |
| 19 | 2008 | 7 | |
| 20 | 2022 | 5 |
About T.C. Chai
T.C. Chai is a scholar working on Electrical and Electronic Engineering, Mechanics of Materials, Mechanical Engineering, Electronic, Optical and Magnetic Materials and Biomedical Engineering, having authored 43 papers that have together received 869 indexed citations. Recurring topics across this work include Electronic Packaging and Soldering Technologies (39 papers), 3D IC and TSV technologies (34 papers), Integrated Circuits and Semiconductor Failure Analysis (6 papers), Copper Interconnects and Reliability (6 papers), Material Properties and Processing (6 papers), Electromagnetic Compatibility and Noise Suppression (5 papers), Advanced Surface Polishing Techniques (4 papers) and Metal and Thin Film Mechanics (3 papers). The work is most often cited by research in Electrical and Electronic Engineering (820 citations), Automotive Engineering (141 citations), Electronic, Optical and Magnetic Materials (99 citations), Mechanics of Materials (94 citations) and Biomedical Engineering (144 citations). T.C. Chai has collaborated with scholars based in Singapore, United States and Hong Kong. Frequent co-authors include Xiaowu Zhang, John H. Lau, Cheryl Selvanayagam, Kripesh Vaidyanathan, S. Seah, V. Kripesh, E.B. Liao, Navas Khan, Fa Xing and S.K.W. Seah. Their work appears in journals such as Journal of Electronic Materials, Microelectronics Reliability, IEEE Transactions on Advanced Packaging, IEEE Transactions on Components Packaging and Manufacturing Technology and IEEE Transactions on Device and Materials Reliability.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.