Xiaowu Zhang

152 papers and 3.0k indexed citations i.

Xiaowu Zhang has authored 152 papers that have received a total of 3.0k indexed citations. This includes 81 papers in Electrical and Electronic Engineering, 44 papers in Mechanical Engineering and 17 papers in Mechanics of Materials. The topics of these papers are Electronic Packaging and Soldering Technologies (60 papers), 3D IC and TSV technologies (57 papers) and Heat Transfer and Optimization (22 papers). Xiaowu Zhang is often cited by papers focused on Electronic Packaging and Soldering Technologies (60 papers), 3D IC and TSV technologies (57 papers) and Heat Transfer and Optimization (22 papers) and collaborates with scholars based in Singapore, China and United States. Xiaowu Zhang's co-authors include Yong Han, Boon Long Lau, Fa Xing, John H. Lau and T.C. Chai and has published in prestigious journals such as Science, Journal of Biological Chemistry and Advanced Materials.