E.H. Wong
Impact in
- Mechanics of Materials top 1%
- Mechanical Behavior of Composites
- Material Properties and Processing
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- Electronic Packaging and Soldering Technologies
- 3D IC and TSV technologies
- Electrostatic Discharge in Electronics
- Integrated Circuits and Semiconductor Failure Analysis
Papers in
-
- Electronic Packaging and Soldering Technologies 96
- 3D IC and TSV technologies 53
- Integrated Circuits and Semiconductor Failure Analysis 18
- Electrostatic Discharge in Electronics 15
-
- Material Properties and Processing 28
- Mechanical Behavior of Composites 27
- Adhesion, Friction, and Surface Interactions 11
- Co-authors
- R. Rajoo (29 shared papers)S.K.W. Seah (33 shared papers)Subodh G. Mhaisalkar (17 shared papers)T.B. Lim (10 shared papers)Yiu‐Wing Mai (14 shared papers)Gary R. Weisman (4 shared papers)Carolyn J. Anderson (4 shared papers)Thaddeus J. Wadas (2 shared papers)
- Journals
- Microelectronics Reliability (16 papers)Journal of Electronic Materials (8 papers)IEEE Transactions on Components and Packaging Technologies (8 papers)IEEE Transactions on Advanced Packaging (7 papers)International Journal of Fatigue (4 papers)
- Partner nations
- SingaporeUnited StatesAustralia
In The Last Decade
E.H. Wong
145 papers receiving 3.3k citations
Peers
Comparison fields: 5 of 126
- Mechanics of Materials 1.1k
- Electrical and Electronic Engineering 2.2k
- Mechanical Engineering 820
- Polymers and Plastics 168
- Radiology, Nuclear Medicine and Imaging 229
Countries citing papers authored by E.H. Wong
This map shows the geographic impact of E.H. Wong's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by E.H. Wong with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites E.H. Wong more than expected).
Fields of papers citing papers by E.H. Wong
This network shows the impact of papers produced by E.H. Wong. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by E.H. Wong. The network helps show where E.H. Wong may publish in the future.
Co-authors
The 25 scholars most cited alongside E.H. Wong, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.
All Works
Showing the 20 most-cited of 146 papers — load more, or switch the sort, to bring in the rest.
| # | Work | ||
|---|---|---|---|
| 1 | 2006 | 244 | |
| 2 | 2008 | 221 | |
| 3 | 2002 | 113 | |
| 4 | 2003 | 104 | |
| 5 | 2002 | 101 | |
| 6 | 2013 | 91 | |
| 7 | 2004 | 82 | |
| 8 | 2003 | 79 | |
| 9 | 2003 | 77 | |
| 10 | 2008 | 76 | |
| 11 | 1994 | 74 | |
| 12 | 2002 | 72 | |
| 13 | 2005 | 68 | |
| 14 | 2008 | 64 | |
| 15 | 2002 | 62 | |
| 16 | 2005 | 57 | |
| 17 | Cross-bridged macrocyclic chelators for stable complexation of copper radionuclides for PET imaging. | 2008 | 57 |
| 18 | 2002 | 57 | |
| 19 | 2005 | 54 | |
| 20 | 2016 | 53 |
About E.H. Wong
E.H. Wong is a scholar working on Electrical and Electronic Engineering, Mechanics of Materials, Mechanical Engineering, Materials Chemistry and Civil and Structural Engineering, having authored 146 papers that have together received 3.5k indexed citations. Recurring topics across this work include Electronic Packaging and Soldering Technologies (96 papers), 3D IC and TSV technologies (53 papers), Material Properties and Processing (28 papers), Mechanical Behavior of Composites (27 papers), Integrated Circuits and Semiconductor Failure Analysis (18 papers), High-Velocity Impact and Material Behavior (17 papers), Electrostatic Discharge in Electronics (15 papers) and Adhesion, Friction, and Surface Interactions (11 papers). The work is most often cited by research in Mechanics of Materials (1.1k citations), Electrical and Electronic Engineering (2.2k citations), Mechanical Engineering (820 citations), Polymers and Plastics (168 citations) and Radiology, Nuclear Medicine and Imaging (229 citations). E.H. Wong has collaborated with scholars based in Singapore, United States and Australia. Frequent co-authors include R. Rajoo, S.K.W. Seah, Subodh G. Mhaisalkar, T.B. Lim, Yiu‐Wing Mai, Gary R. Weisman, Carolyn J. Anderson, Thaddeus J. Wadas, Sau Koh and Chwee Teck Lim. Their work appears in journals such as Microelectronics Reliability, Journal of Electronic Materials, IEEE Transactions on Components and Packaging Technologies, IEEE Transactions on Advanced Packaging and International Journal of Fatigue.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.