M.K. Iyer
Impact in
-
- 3D IC and TSV technologies
- Electromagnetic Compatibility and Noise Suppression
- Electronic Packaging and Soldering Technologies
- Electrostatic Discharge in Electronics
- Electromagnetic Compatibility and Measurements
- Microwave Engineering and Waveguides
-
- Advanced Antenna and Metasurface Technologies
Papers in
-
- Electronic Packaging and Soldering Technologies 36
- 3D IC and TSV technologies 35
- Electromagnetic Compatibility and Noise Suppression 28
- Electrostatic Discharge in Electronics 6
- Electromagnetic Compatibility and Measurements 6
- Microwave Engineering and Waveguides 5
- Co-authors
- Mihai Rotaru (9 shared papers)V. Kripesh (11 shared papers)D. Pinjala (14 shared papers)Madhavan Swaminathan (4 shared papers)L.D. Smith (2 shared papers)Sungjun Chun (2 shared papers)Joungho Kim (6 shared papers)Seung Wook Yoon (6 shared papers)
- Journals
- IEEE Transactions on Advanced Packaging (6 papers)Journal of the American Chemical Society (1 paper)Journal of Lightwave Technology (1 paper)IEEE Transactions on Microwave Theory and Techniques (1 paper)IEEE Microwave and Wireless Components Letters (1 paper)
- Partner nations
- SingaporeUnited StatesSouth Korea
In The Last Decade
M.K. Iyer
62 papers receiving 525 citations
Peers
Comparison fields: 5 of 40
- Electrical and Electronic Engineering 470
- Aerospace Engineering 64
- Hardware and Architecture 17
- Electronic, Optical and Magnetic Materials 46
- Mechanical Engineering 90
Countries citing papers authored by M.K. Iyer
This map shows the geographic impact of M.K. Iyer's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by M.K. Iyer with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites M.K. Iyer more than expected).
Fields of papers citing papers by M.K. Iyer
This network shows the impact of papers produced by M.K. Iyer. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by M.K. Iyer. The network helps show where M.K. Iyer may publish in the future.
Co-authors
The 25 scholars most cited alongside M.K. Iyer, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.
All Works
Showing the 20 most-cited of 68 papers — load more, or switch the sort, to bring in the rest.
| # | Work | ||
|---|---|---|---|
| 1 | 2001 | 90 | |
| 2 | 2005 | 53 | |
| 3 | 2006 | 41 | |
| 4 | 2005 | 40 | |
| 5 | 2024 | 29 | |
| 6 | 2005 | 24 | |
| 7 | 2003 | 24 | |
| 8 | 2005 | 15 | |
| 9 | 2002 | 14 | |
| 10 | 2004 | 13 | |
| 11 | 2002 | 13 | |
| 12 | 2003 | 12 | |
| 13 | 2002 | 11 | |
| 14 | 2004 | 11 | |
| 15 | 2004 | 10 | |
| 16 | 2003 | 10 | |
| 17 | 2006 | 10 | |
| 18 | 2004 | 9 | |
| 19 | 2004 | 9 | |
| 20 | 2007 | 8 |
About M.K. Iyer
M.K. Iyer is a scholar working on Electrical and Electronic Engineering, Biomedical Engineering, Mechanical Engineering, Electronic, Optical and Magnetic Materials and Mechanics of Materials, having authored 68 papers that have together received 560 indexed citations. Recurring topics across this work include Electronic Packaging and Soldering Technologies (36 papers), 3D IC and TSV technologies (35 papers), Electromagnetic Compatibility and Noise Suppression (28 papers), Copper Interconnects and Reliability (6 papers), Heat Transfer and Optimization (6 papers), Electrostatic Discharge in Electronics (6 papers), Electromagnetic Compatibility and Measurements (6 papers) and Microwave Engineering and Waveguides (5 papers). The work is most often cited by research in Electrical and Electronic Engineering (470 citations), Aerospace Engineering (64 citations), Hardware and Architecture (17 citations), Electronic, Optical and Magnetic Materials (46 citations) and Mechanical Engineering (90 citations). M.K. Iyer has collaborated with scholars based in Singapore, United States and South Korea. Frequent co-authors include Mihai Rotaru, V. Kripesh, D. Pinjala, Madhavan Swaminathan, L.D. Smith, Sungjun Chun, Joungho Kim, Seung Wook Yoon, C.S. Premachandran and K.C. Toh. Their work appears in journals such as IEEE Transactions on Advanced Packaging, Journal of the American Chemical Society, Journal of Lightwave Technology, IEEE Transactions on Microwave Theory and Techniques and IEEE Microwave and Wireless Components Letters.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.