V. Kripesh
Impact in
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- 3D IC and TSV technologies
- Electronic Packaging and Soldering Technologies
- Advanced MEMS and NEMS Technologies
- Microwave Engineering and Waveguides
- Electrodeposition and Electroless Coatings
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- Copper Interconnects and Reliability
Papers in
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- 3D IC and TSV technologies 59
- Electronic Packaging and Soldering Technologies 49
- Advanced MEMS and NEMS Technologies 9
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- Copper Interconnects and Reliability 10
- Co-authors
- John Hon-Shing Lau (32 shared papers)Andrew A. O. Tay (24 shared papers)Seung Wook Yoon (27 shared papers)Vempati Srinivasa Rao (19 shared papers)Navas Khan (14 shared papers)Soon Wee Ho (10 shared papers)Damaruganath Pinjala (17 shared papers)Xiaowu Zhang (25 shared papers)
- Journals
- IEEE Transactions on Components Packaging and Manufacturing Technology (9 papers)IEEE Transactions on Advanced Packaging (8 papers)IEEE Transactions on Components and Packaging Technologies (5 papers)Materials Letters (2 papers)Materials Science and Engineering A (2 papers)
- Partner nations
- SingaporeUnited StatesTaiwan
In The Last Decade
V. Kripesh
102 papers receiving 1.7k citations
Peers
Comparison fields: 5 of 34
- Electrical and Electronic Engineering 1.8k
- Electronic, Optical and Magnetic Materials 62
- Mechanical Engineering 85
- Ceramics and Composites 12
- Hardware and Architecture 15
Countries citing papers authored by V. Kripesh
This map shows the geographic impact of V. Kripesh's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by V. Kripesh with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites V. Kripesh more than expected).
Fields of papers citing papers by V. Kripesh
This network shows the impact of papers produced by V. Kripesh. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by V. Kripesh. The network helps show where V. Kripesh may publish in the future.
Co-authors
The 25 scholars most cited alongside V. Kripesh, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.
All Works
Showing the 20 most-cited of 107 papers — load more, or switch the sort, to bring in the rest.
| # | Work | ||
|---|---|---|---|
| 1 | 2006 | 150 | |
| 2 | 2008 | 109 | |
| 3 | 2010 | 103 | |
| 4 | 2009 | 99 | |
| 5 | 2006 | 87 | |
| 6 | 2008 | 68 | |
| 7 | 2011 | 59 | |
| 8 | 2005 | 54 | |
| 9 | 2009 | 54 | |
| 10 | 2013 | 47 | |
| 11 | 2009 | 46 | |
| 12 | 2006 | 44 | |
| 13 | 2009 | 43 | |
| 14 | 2009 | 42 | |
| 15 | 2006 | 38 | |
| 16 | 2008 | 38 | |
| 17 | 2009 | 32 | |
| 18 | 2009 | 30 | |
| 19 | 2007 | 29 | |
| 20 | 2008 | 29 |
About V. Kripesh
V. Kripesh is a scholar working on Electrical and Electronic Engineering, Electronic, Optical and Magnetic Materials, Mechanics of Materials, Materials Chemistry and Biomedical Engineering, having authored 107 papers that have together received 1.9k indexed citations. Recurring topics across this work include 3D IC and TSV technologies (59 papers), Electronic Packaging and Soldering Technologies (49 papers), Copper Interconnects and Reliability (10 papers), Advanced MEMS and NEMS Technologies (9 papers), Metal and Thin Film Mechanics (4 papers), Anodic Oxide Films and Nanostructures (4 papers), Advanced Surface Polishing Techniques (2 papers) and Heat Transfer and Optimization (2 papers). The work is most often cited by research in Electrical and Electronic Engineering (1.8k citations), Electronic, Optical and Magnetic Materials (62 citations), Mechanical Engineering (85 citations), Ceramics and Composites (12 citations) and Hardware and Architecture (15 citations). V. Kripesh has collaborated with scholars based in Singapore, United States and Taiwan. Frequent co-authors include John Hon-Shing Lau, Andrew A. O. Tay, Seung Wook Yoon, Vempati Srinivasa Rao, Navas Khan, Soon Wee Ho, Damaruganath Pinjala, Xiaowu Zhang, Aditya Kumar and T.C. Chai. Their work appears in journals such as IEEE Transactions on Components Packaging and Manufacturing Technology, IEEE Transactions on Advanced Packaging, IEEE Transactions on Components and Packaging Technologies, Materials Letters and Materials Science and Engineering A.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.