V. Kripesh
Impact in
-
- 3D IC and TSV technologies
- Electronic Packaging and Soldering Technologies
- Semiconductor materials and devices
- Integrated Circuits and Semiconductor Failure Analysis
- Automotive Engineering top 5%
- Additive Manufacturing and 3D Printing Technologies
Papers in
-
- Electronic Packaging and Soldering Technologies 80
- 3D IC and TSV technologies 73
- Advanced MEMS and NEMS Technologies 9
- Electromagnetic Compatibility and Noise Suppression 7
- Co-authors
- John H. Lau (32 shared papers)Seung Wook Yoon (27 shared papers)A.A.O. Tay (24 shared papers)Navas Khan (14 shared papers)D. Pinjala (17 shared papers)Soon Wee Ho (9 shared papers)Vempati Srinivasa Rao (13 shared papers)Xiaowu Zhang (22 shared papers)
- Journals
- IEEE Transactions on Components Packaging and Manufacturing Technology (9 papers)IEEE Transactions on Advanced Packaging (8 papers)IEEE Transactions on Components and Packaging Technologies (5 papers)Materials Science and Engineering A (2 papers)Sensors and Actuators A Physical (2 papers)
- Partner nations
- SingaporeUnited StatesTaiwan
In The Last Decade
V. Kripesh
102 papers receiving 1.7k citations
Peers
Comparison fields: 5 of 55
- Electrical and Electronic Engineering 1.7k
- Automotive Engineering 253
- Electronic, Optical and Magnetic Materials 205
- Mechanical Engineering 410
- General Materials Science 24
Countries citing papers authored by V. Kripesh
This map shows the geographic impact of V. Kripesh's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by V. Kripesh with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites V. Kripesh more than expected).
Fields of papers citing papers by V. Kripesh
This network shows the impact of papers produced by V. Kripesh. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by V. Kripesh. The network helps show where V. Kripesh may publish in the future.
Co-authors
The 25 scholars most cited alongside V. Kripesh, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.
All Works
Showing the 20 most-cited of 106 papers — load more, or switch the sort, to bring in the rest.
| # | Work | ||
|---|---|---|---|
| 1 | 2006 | 149 | |
| 2 | 2008 | 108 | |
| 3 | 2010 | 102 | |
| 4 | 2009 | 98 | |
| 5 | 2006 | 88 | |
| 6 | 2008 | 69 | |
| 7 | 2011 | 57 | |
| 8 | 2009 | 54 | |
| 9 | 2005 | 54 | |
| 10 | 2013 | 47 | |
| 11 | 2006 | 44 | |
| 12 | 2009 | 44 | |
| 13 | 2009 | 42 | |
| 14 | 2009 | 41 | |
| 15 | 2006 | 40 | |
| 16 | 2008 | 36 | |
| 17 | 2009 | 29 | |
| 18 | 2008 | 29 | |
| 19 | 2007 | 29 | |
| 20 | 2009 | 28 |
About V. Kripesh
V. Kripesh is a scholar working on Electrical and Electronic Engineering, Mechanical Engineering, Biomedical Engineering, Electronic, Optical and Magnetic Materials and Automotive Engineering, having authored 106 papers that have together received 1.9k indexed citations. Recurring topics across this work include Electronic Packaging and Soldering Technologies (80 papers), 3D IC and TSV technologies (73 papers), Copper Interconnects and Reliability (18 papers), Advanced MEMS and NEMS Technologies (9 papers), Nanofabrication and Lithography Techniques (8 papers), Additive Manufacturing and 3D Printing Technologies (8 papers), Advanced Surface Polishing Techniques (7 papers) and Electromagnetic Compatibility and Noise Suppression (7 papers). The work is most often cited by research in Electrical and Electronic Engineering (1.7k citations), Automotive Engineering (253 citations), Electronic, Optical and Magnetic Materials (205 citations), Mechanical Engineering (410 citations) and General Materials Science (24 citations). V. Kripesh has collaborated with scholars based in Singapore, United States and Taiwan. Frequent co-authors include John H. Lau, Seung Wook Yoon, A.A.O. Tay, Navas Khan, D. Pinjala, Soon Wee Ho, Vempati Srinivasa Rao, Xiaowu Zhang, Aditya Kumar and T.C. Chai. Their work appears in journals such as IEEE Transactions on Components Packaging and Manufacturing Technology, IEEE Transactions on Advanced Packaging, IEEE Transactions on Components and Packaging Technologies, Materials Science and Engineering A and Sensors and Actuators A Physical.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.