Daquan Yu
Impact in
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- Electronic Packaging and Soldering Technologies
- 3D IC and TSV technologies
- General Materials Science top 0.5%
Papers in
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- 3D IC and TSV technologies 140
- Electronic Packaging and Soldering Technologies 128
- Semiconductor Lasers and Optical Devices 16
- Semiconductor materials and devices 15
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- Nanofabrication and Lithography Techniques 22
- Co-authors
- Lu Wang (15 shared papers)Chi‐Man Lawrence Wu (12 shared papers)C. Law (9 shared papers)J.K.L. Lai (4 shared papers)Hong‐Bin Xie (3 shared papers)W. Jillek (2 shared papers)Lixi Wan (27 shared papers)John H. Lau (11 shared papers)
In The Last Decade
Daquan Yu
185 papers receiving 2.7k citations
Daquan Yu's Hit Papers
Peers
Comparison fields: 5 of 75
- Electrical and Electronic Engineering 2.5k
- General Materials Science 132
- Mechanical Engineering 1.3k
- Automotive Engineering 172
- Aerospace Engineering 321
Countries citing papers authored by Daquan Yu
This map shows the geographic impact of Daquan Yu's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Daquan Yu with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Daquan Yu more than expected).
Fields of papers citing papers by Daquan Yu
This network shows the impact of papers produced by Daquan Yu. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Daquan Yu. The network helps show where Daquan Yu may publish in the future.
Co-authors
The 25 scholars most cited alongside Daquan Yu, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.
All Works
Showing the 20 most-cited of 205 papers — load more, or switch the sort, to bring in the rest.
| # | Work | ||
|---|---|---|---|
| 1 | Properties of lead-free solder alloys with rare earth element additions Hit paper breakdown → | 2004 | 517 |
| 2 | 2004 | 120 | |
| 3 | 2002 | 110 | |
| 4 | 2004 | 99 | |
| 5 | 2003 | 97 | |
| 6 | 2002 | 83 | |
| 7 | 2006 | 80 | |
| 8 | 2006 | 71 | |
| 9 | 2004 | 71 | |
| 10 | 2004 | 62 | |
| 11 | 2010 | 59 | |
| 12 | 2002 | 57 | |
| 13 | 2009 | 53 | |
| 14 | 2006 | 48 | |
| 15 | 2009 | 42 | |
| 16 | 2005 | 38 | |
| 17 | 2021 | 37 | |
| 18 | 2019 | 32 | |
| 19 | 2023 | 30 | |
| 20 | 2023 | 27 |
About Daquan Yu
Daquan Yu is a scholar working on Electrical and Electronic Engineering, Biomedical Engineering, Mechanical Engineering, Automotive Engineering and Electronic, Optical and Magnetic Materials, having authored 205 papers that have together received 2.8k indexed citations. Recurring topics across this work include 3D IC and TSV technologies (140 papers), Electronic Packaging and Soldering Technologies (128 papers), Nanofabrication and Lithography Techniques (22 papers), Additive Manufacturing and 3D Printing Technologies (21 papers), Semiconductor Lasers and Optical Devices (16 papers), Copper Interconnects and Reliability (16 papers), Semiconductor materials and devices (15 papers) and Intermetallics and Advanced Alloy Properties (14 papers). The work is most often cited by research in Electrical and Electronic Engineering (2.5k citations), General Materials Science (132 citations), Mechanical Engineering (1.3k citations), Automotive Engineering (172 citations) and Aerospace Engineering (321 citations). Daquan Yu has collaborated with scholars based in China, Singapore and Hong Kong. Frequent co-authors include Lu Wang, Chi‐Man Lawrence Wu, C. Law, J.K.L. Lai, Hong‐Bin Xie, W. Jillek, Lixi Wan, John H. Lau, Haitao Ma and Li Chen. Their work appears in journals such as Journal of Materials Science Materials in Electronics, IEEE Transactions on Components Packaging and Manufacturing Technology, Journal of Electronic Materials, Microsystem Technologies and IEEE Electron Device Letters.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.