T.B. Lim
Impact in
- Mechanics of Materials top 5%
- Mechanical Behavior of Composites
- Material Properties and Processing
- Adhesion, Friction, and Surface Interactions
- Surfaces, Coatings and Films top 5%
- Surface Modification and Superhydrophobicity
Papers in
-
- Mechanical Behavior of Composites 8
- Material Properties and Processing 7
- Adhesion, Friction, and Surface Interactions 6
-
- Electronic Packaging and Soldering Technologies 18
- 3D IC and TSV technologies 8
- Electrostatic Discharge in Electronics 6
- Co-authors
- E.H. Wong (10 shared papers)R. Rajoo (5 shared papers)C.Q. Cui (16 shared papers)A.A.O. Tay (4 shared papers)K.C. Chan (4 shared papers)E. T. Kang (14 shared papers)K. G. Neoh (13 shared papers)Sau Koh (2 shared papers)
- Journals
- Journal of Adhesion Science and Technology (3 papers)Polymer (3 papers)Journal of Electronic Packaging (3 papers)The Journal of Adhesion (2 papers)IEEE Transactions on Components and Packaging Technologies (2 papers)
- Partner nations
- SingaporeAustraliaUnited States
In The Last Decade
T.B. Lim
39 papers receiving 828 citations
Peers
Comparison fields: 5 of 68
- Mechanics of Materials 380
- Surfaces, Coatings and Films 107
- Electrical and Electronic Engineering 529
- Polymers and Plastics 126
- Mechanical Engineering 199
Countries citing papers authored by T.B. Lim
This map shows the geographic impact of T.B. Lim's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by T.B. Lim with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites T.B. Lim more than expected).
Fields of papers citing papers by T.B. Lim
This network shows the impact of papers produced by T.B. Lim. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by T.B. Lim. The network helps show where T.B. Lim may publish in the future.
Co-authors
The 25 scholars most cited alongside T.B. Lim, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.
All Works
Showing the 20 most-cited of 39 papers — load more, or switch the sort, to bring in the rest.
| # | Work | ||
|---|---|---|---|
| 1 | 2002 | 126 | |
| 2 | 2002 | 109 | |
| 3 | 2001 | 73 | |
| 4 | 1994 | 72 | |
| 5 | 1997 | 54 | |
| 6 | 1990 | 43 | |
| 7 | 2000 | 42 | |
| 8 | 2002 | 32 | |
| 9 | 1998 | 29 | |
| 10 | 2003 | 28 | |
| 11 | 2001 | 25 | |
| 12 | 2006 | 22 | |
| 13 | 1995 | 21 | |
| 14 | 1993 | 21 | |
| 15 | 2001 | 18 | |
| 16 | 1998 | 18 | |
| 17 | 2002 | 17 | |
| 18 | 2005 | 13 | |
| 19 | 2000 | 12 | |
| 20 | 2005 | 11 |
About T.B. Lim
T.B. Lim is a scholar working on Mechanics of Materials, Electrical and Electronic Engineering, Surfaces, Coatings and Films, Mechanical Engineering and Materials Chemistry, having authored 39 papers that have together received 890 indexed citations. Recurring topics across this work include Electronic Packaging and Soldering Technologies (18 papers), Surface Modification and Superhydrophobicity (10 papers), Mechanical Behavior of Composites (8 papers), 3D IC and TSV technologies (8 papers), Material Properties and Processing (7 papers), Electrostatic Discharge in Electronics (6 papers), Adhesion, Friction, and Surface Interactions (6 papers) and Synthesis and properties of polymers (4 papers). The work is most often cited by research in Mechanics of Materials (380 citations), Surfaces, Coatings and Films (107 citations), Electrical and Electronic Engineering (529 citations), Polymers and Plastics (126 citations) and Mechanical Engineering (199 citations). T.B. Lim has collaborated with scholars based in Singapore, Australia and United States. Frequent co-authors include E.H. Wong, R. Rajoo, C.Q. Cui, A.A.O. Tay, K.C. Chan, E. T. Kang, K. G. Neoh, Sau Koh, Xuejun Fan and K. L. Tan. Their work appears in journals such as Journal of Adhesion Science and Technology, Polymer, Journal of Electronic Packaging, The Journal of Adhesion and IEEE Transactions on Components and Packaging Technologies.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.