L.D. Smith
Impact in
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- Electromagnetic Compatibility and Noise Suppression
- 3D IC and TSV technologies
- Low-power high-performance VLSI design
- Electrostatic Discharge in Electronics
- Electronic Packaging and Soldering Technologies
- VLSI and FPGA Design Techniques
- Electromagnetic Compatibility and Measurements
- Hardware and Architecture top 5%
Papers in
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- Electromagnetic Compatibility and Noise Suppression 20
- 3D IC and TSV technologies 14
- Electronic Packaging and Soldering Technologies 8
- Electrostatic Discharge in Electronics 5
- Low-power high-performance VLSI design 5
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- Radar Systems and Signal Processing 6
- GNSS positioning and interference 4
- Co-authors
- Tapas Roy (6 shared papers)D. Forehand (2 shared papers)Richard E. Anderson (1 shared paper)Madhavan Swaminathan (7 shared papers)Robert Anderson (3 shared papers)Sungjun Chun (4 shared papers)Greg Smith (1 shared paper)Sherief Reda (1 shared paper)
- Journals
- IEEE Transactions on Advanced Packaging (3 papers)IEEE Transactions on Very Large Scale Integration (VLSI) Systems (1 paper)IEEE Micro (1 paper)IEEE Journal of Solid-State Circuits (1 paper)Biology of Reproduction (1 paper)
- Partner nations
- United StatesSingaporeSouth Korea
In The Last Decade
L.D. Smith
44 papers receiving 1.1k citations
Peers
Comparison fields: 5 of 95
- Electrical and Electronic Engineering 1.0k
- Hardware and Architecture 108
- Aerospace Engineering 172
- History and Philosophy of Science 23
- Astronomy and Astrophysics 64
Countries citing papers authored by L.D. Smith
This map shows the geographic impact of L.D. Smith's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by L.D. Smith with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites L.D. Smith more than expected).
Fields of papers citing papers by L.D. Smith
This network shows the impact of papers produced by L.D. Smith. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by L.D. Smith. The network helps show where L.D. Smith may publish in the future.
Co-authors
The 25 scholars most cited alongside L.D. Smith, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.
All Works
Showing the 20 most-cited of 47 papers — load more, or switch the sort, to bring in the rest.
| # | Work | ||
|---|---|---|---|
| 1 | 1999 | 379 | |
| 2 | 2001 | 90 | |
| 3 | 2009 | 70 | |
| 4 | 2001 | 66 | |
| 5 | 2002 | 59 | |
| 6 | 1991 | 57 | |
| 7 | 1989 | 55 | |
| 8 | 1989 | 39 | |
| 9 | 2016 | 37 | |
| 10 | 1987 | 35 | |
| 11 | 2002 | 33 | |
| 12 | 2003 | 31 | |
| 13 | 2002 | 27 | |
| 14 | 1989 | 26 | |
| 15 | 2011 | 26 | |
| 16 | 1996 | 26 | |
| 17 | 2002 | 26 | |
| 18 | 2002 | 25 | |
| 19 | 2003 | 17 | |
| 20 | 2002 | 17 |
About L.D. Smith
L.D. Smith is a scholar working on Electrical and Electronic Engineering, Aerospace Engineering, Artificial Intelligence, Computer Networks and Communications and Hardware and Architecture, having authored 47 papers that have together received 1.3k indexed citations. Recurring topics across this work include Electromagnetic Compatibility and Noise Suppression (20 papers), 3D IC and TSV technologies (14 papers), Target Tracking and Data Fusion in Sensor Networks (8 papers), Electronic Packaging and Soldering Technologies (8 papers), Radar Systems and Signal Processing (6 papers), Electrostatic Discharge in Electronics (5 papers), Low-power high-performance VLSI design (5 papers) and GNSS positioning and interference (4 papers). The work is most often cited by research in Electrical and Electronic Engineering (1.0k citations), Hardware and Architecture (108 citations), Aerospace Engineering (172 citations), History and Philosophy of Science (23 citations) and Astronomy and Astrophysics (64 citations). L.D. Smith has collaborated with scholars based in United States, Singapore and South Korea. Frequent co-authors include Tapas Roy, D. Forehand, Richard E. Anderson, Madhavan Swaminathan, Robert Anderson, Sungjun Chun, Greg Smith, Sherief Reda, Timothy J. Schmerbeck and M.K. Iyer. Their work appears in journals such as IEEE Transactions on Advanced Packaging, IEEE Transactions on Very Large Scale Integration (VLSI) Systems, IEEE Micro, IEEE Journal of Solid-State Circuits and Biology of Reproduction.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.