A. Nishimura
Impact in
- Mechanics of Materials top 5%
- Mechanical Behavior of Composites
- Material Properties and Processing
- Fatigue and fracture mechanics
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- Electronic Packaging and Soldering Technologies
- 3D IC and TSV technologies
- Advanced MEMS and NEMS Technologies
- Electrostatic Discharge in Electronics
- Integrated Circuits and Semiconductor Failure Analysis
Papers in
-
- Electronic Packaging and Soldering Technologies 38
- 3D IC and TSV technologies 23
- Electrostatic Discharge in Electronics 6
- Silicon and Solar Cell Technologies 6
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- Material Properties and Processing 7
- Fatigue and fracture mechanics 5
- Mechanical Behavior of Composites 4
- Co-authors
- Sueo KAWAI (16 shared papers)Kunihiko NISHI (7 shared papers)Makoto Kitano (5 shared papers)Hideo Miura (14 shared papers)Hiroki Miura (3 shared papers)Gen Murakami (4 shared papers)Masaharu Kitano (6 shared papers)Tatsuji Sakamoto (1 shared paper)
- Journals
- IEEE Transactions on Electronics Packaging Manufacturing (2 papers)Journal of Electronic Packaging (2 papers)Materials Science and Engineering A (1 paper)IEEE Transactions on Electron Devices (1 paper)JSME international journal Ser A Mechanics and material engineering (1 paper)
- Partner nations
- JapanUnited StatesUnited Kingdom
In The Last Decade
A. Nishimura
51 papers receiving 607 citations
Peers
Comparison fields: 5 of 36
- Mechanics of Materials 297
- Electrical and Electronic Engineering 581
- Mechanical Engineering 123
- Biomedical Engineering 88
- Polymers and Plastics 23
Countries citing papers authored by A. Nishimura
This map shows the geographic impact of A. Nishimura's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by A. Nishimura with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites A. Nishimura more than expected).
Fields of papers citing papers by A. Nishimura
This network shows the impact of papers produced by A. Nishimura. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by A. Nishimura. The network helps show where A. Nishimura may publish in the future.
Co-authors
The 25 scholars most cited alongside A. Nishimura, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.
All Works
Showing the 20 most-cited of 55 papers — load more, or switch the sort, to bring in the rest.
| # | Work | ||
|---|---|---|---|
| 1 | 1988 | 159 | |
| 2 | 1987 | 52 | |
| 3 | 1989 | 41 | |
| 4 | 2003 | 35 | |
| 5 | 1992 | 30 | |
| 6 | 1993 | 30 | |
| 7 | 1994 | 22 | |
| 8 | 1999 | 22 | |
| 9 | 1994 | 22 | |
| 10 | 1998 | 21 | |
| 11 | 1987 | 21 | |
| 12 | 2002 | 18 | |
| 13 | 2002 | 16 | |
| 14 | 2010 | 16 | |
| 15 | 1995 | 15 | |
| 16 | 1989 | 15 | |
| 17 | 2007 | 15 | |
| 18 | 1994 | 14 | |
| 19 | 1988 | 12 | |
| 20 | 2002 | 8 |
About A. Nishimura
A. Nishimura is a scholar working on Electrical and Electronic Engineering, Mechanics of Materials, Mechanical Engineering, Materials Chemistry and Biomedical Engineering, having authored 55 papers that have together received 665 indexed citations. Recurring topics across this work include Electronic Packaging and Soldering Technologies (38 papers), 3D IC and TSV technologies (23 papers), Material Properties and Processing (7 papers), Electrostatic Discharge in Electronics (6 papers), Silicon and Solar Cell Technologies (6 papers), Fatigue and fracture mechanics (5 papers), Mechanical Behavior of Composites (4 papers) and Non-Destructive Testing Techniques (4 papers). The work is most often cited by research in Mechanics of Materials (297 citations), Electrical and Electronic Engineering (581 citations), Mechanical Engineering (123 citations), Biomedical Engineering (88 citations) and Polymers and Plastics (23 citations). A. Nishimura has collaborated with scholars based in Japan, United States and United Kingdom. Frequent co-authors include Sueo KAWAI, Kunihiko NISHI, Makoto Kitano, Hideo Miura, Hiroki Miura, Gen Murakami, Masaharu Kitano, Tatsuji Sakamoto, Tetsuo KUMAZAWA and Haruo Akahoshi. Their work appears in journals such as IEEE Transactions on Electronics Packaging Manufacturing, Journal of Electronic Packaging, Materials Science and Engineering A, IEEE Transactions on Electron Devices and JSME international journal Ser A Mechanics and material engineering.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.