C.P. Wong
Impact in
- Polymers and Plastics top 0.1%
- Conducting polymers and applications
-
- Supercapacitor Materials and Fabrication
Papers in
-
- Electronic Packaging and Soldering Technologies 272
- 3D IC and TSV technologies 172
- Nanomaterials and Printing Technologies 45
-
- Advanced Sensor and Energy Harvesting Materials 137
- Co-authors
- Kyoung‐sik Moon (134 shared papers)Yi Li (24 shared papers)Wei Lin (31 shared papers)Yonghao Xiu (33 shared papers)Ziyin Lin (27 shared papers)Dennis W. Hess (30 shared papers)Jianwen Xu (25 shared papers)Zhong Lin Wang (9 shared papers)
- Journals
- IEEE Transactions on Components and Packaging Technologies (30 papers)IEEE Transactions on Electronics Packaging Manufacturing (21 papers)Journal of Electronic Materials (20 papers)Journal of Applied Polymer Science (18 papers)IEEE Transactions on Advanced Packaging (15 papers)
- Partner nations
- United StatesChinaHong Kong
In The Last Decade
C.P. Wong
644 papers receiving 21.8k citations
C.P. Wong's Hit Papers
Peers
Comparison fields: 5 of 153
- Polymers and Plastics 5.2k
- Electronic, Optical and Magnetic Materials 5.2k
- Surfaces, Coatings and Films 1.4k
- Electrical and Electronic Engineering 11.2k
- Biomedical Engineering 8.3k
Countries citing papers authored by C.P. Wong
This map shows the geographic impact of C.P. Wong's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by C.P. Wong with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites C.P. Wong more than expected).
Fields of papers citing papers by C.P. Wong
This network shows the impact of papers produced by C.P. Wong. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by C.P. Wong. The network helps show where C.P. Wong may publish in the future.
Co-authors
The 25 scholars most cited alongside C.P. Wong, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.
All Works
Showing the 20 most-cited of 663 papers — load more, or switch the sort, to bring in the rest.
| # | Work | ||
|---|---|---|---|
| 1 | Low-Cost High-Performance Solid-State Asymmetric Supercapacitors Based on MnO2 Nanowires and Fe2O3 Nanotubes Hit paper breakdown → | 2014 | 1011 |
| 2 | Hydrogenated ZnO Core–Shell Nanocables for Flexible Supercapacitors and Self-Powered Systems Hit paper breakdown → | 2013 | 772 |
| 3 | Graphene-based nitrogen self-doped hierarchical porous carbon aerogels derived from chitosan for high performance supercapacitors Hit paper breakdown → | 2015 | 584 |
| 4 | Thermal conductivity, elastic modulus, and coefficient of thermal expansion of polymer composites filled with ceramic particles for electronic packaging Hit paper breakdown → | 1999 | 577 |
| 5 | Hierarchical porous carbon aerogel derived from bagasse for high performance supercapacitor electrode Hit paper breakdown → | 2014 | 573 |
| 6 | Recent advances of conductive adhesives as a lead-free alternative in electronic packaging: Materials, processing, reliability and applications Hit paper breakdown → | 2006 | 546 |
| 7 | 2005 | 402 | |
| 8 | 2005 | 329 | |
| 9 | 2004 | 320 | |
| 10 | 2011 | 305 | |
| 11 | 2001 | 287 | |
| 12 | 2011 | 282 | |
| 13 | 2007 | 277 | |
| 14 | 2017 | 262 | |
| 15 | 2013 | 262 | |
| 16 | 2009 | 251 | |
| 17 | 2014 | 241 | |
| 18 | 2006 | 241 | |
| 19 | 2008 | 233 | |
| 20 | 2006 | 227 |
About C.P. Wong
C.P. Wong is a scholar working on Electrical and Electronic Engineering, Biomedical Engineering, Materials Chemistry, Polymers and Plastics and Mechanical Engineering, having authored 663 papers that have together received 22.4k indexed citations. Recurring topics across this work include Electronic Packaging and Soldering Technologies (272 papers), 3D IC and TSV technologies (172 papers), Advanced Sensor and Energy Harvesting Materials (137 papers), Synthesis and properties of polymers (76 papers), Epoxy Resin Curing Processes (70 papers), Adhesion, Friction, and Surface Interactions (47 papers), Nanomaterials and Printing Technologies (45 papers) and Conducting polymers and applications (41 papers). The work is most often cited by research in Polymers and Plastics (5.2k citations), Electronic, Optical and Magnetic Materials (5.2k citations), Surfaces, Coatings and Films (1.4k citations), Electrical and Electronic Engineering (11.2k citations) and Biomedical Engineering (8.3k citations). C.P. Wong has collaborated with scholars based in United States, China and Hong Kong. Frequent co-authors include Kyoung‐sik Moon, Yi Li, Wei Lin, Yonghao Xiu, Ziyin Lin, Dennis W. Hess, Jianwen Xu, Zhong Lin Wang, Daoqiang Lu and Rongwei Zhang. Their work appears in journals such as IEEE Transactions on Components and Packaging Technologies, IEEE Transactions on Electronics Packaging Manufacturing, Journal of Electronic Materials, Journal of Applied Polymer Science and IEEE Transactions on Advanced Packaging.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.