Simon S. Ang
Impact in
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- Advanced DC-DC Converters
- Silicon Carbide Semiconductor Technologies
- Multilevel Inverters and Converters
- Electromagnetic Compatibility and Noise Suppression
- Semiconductor materials and devices
- 3D IC and TSV technologies
- Electronic Packaging and Soldering Technologies
- Bioengineering top 5%
Papers in
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- Semiconductor materials and devices 49
- Silicon Carbide Semiconductor Technologies 36
- Advanced DC-DC Converters 28
- 3D IC and TSV technologies 26
- Electronic Packaging and Soldering Technologies 26
- Electromagnetic Compatibility and Noise Suppression 21
- Thin-Film Transistor Technologies 14
- Co-authors
- S.K. Chou (10 shared papers)Kaili Zhang (10 shared papers)W.D. Brown (35 shared papers)Wen‐Tso Liu (4 shared papers)Liang Zhu (4 shared papers)William D. Brown (6 shared papers)Alejandro Oliva (3 shared papers)Hameed A. Naseem (15 shared papers)
- Journals
- Journal of Applied Physics (9 papers)IEEE Transactions on Advanced Packaging (6 papers)Journal of Electronic Materials (6 papers)Solid-State Electronics (5 papers)Thin Solid Films (3 papers)
- Partner nations
- United StatesSingaporeChina
In The Last Decade
Simon S. Ang
181 papers receiving 2.5k citations
Peers
Comparison fields: 5 of 105
- Electrical and Electronic Engineering 1.9k
- Bioengineering 81
- Biomedical Engineering 531
- Aerospace Engineering 303
- Mechanics of Materials 291
Countries citing papers authored by Simon S. Ang
This map shows the geographic impact of Simon S. Ang's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Simon S. Ang with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Simon S. Ang more than expected).
Fields of papers citing papers by Simon S. Ang
This network shows the impact of papers produced by Simon S. Ang. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Simon S. Ang. The network helps show where Simon S. Ang may publish in the future.
Co-authors
The 25 scholars most cited alongside Simon S. Ang, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.
All Works
Showing the 20 most-cited of 192 papers — load more, or switch the sort, to bring in the rest.
| # | Work | ||
|---|---|---|---|
| 1 | Power-Switching Converters | 2005 | 149 |
| 2 | 2006 | 114 | |
| 3 | 2005 | 106 | |
| 4 | 2002 | 98 | |
| 5 | 2010 | 96 | |
| 6 | 2004 | 91 | |
| 7 | 2006 | 79 | |
| 8 | 1996 | 75 | |
| 9 | 2004 | 60 | |
| 10 | 2005 | 56 | |
| 11 | 2013 | 56 | |
| 12 | 2005 | 54 | |
| 13 | 1997 | 51 | |
| 14 | 2004 | 47 | |
| 15 | 2004 | 47 | |
| 16 | 2017 | 46 | |
| 17 | 2016 | 44 | |
| 18 | 2017 | 44 | |
| 19 | 2005 | 39 | |
| 20 | 1999 | 38 |
About Simon S. Ang
Simon S. Ang is a scholar working on Electrical and Electronic Engineering, Materials Chemistry, Biomedical Engineering, Mechanics of Materials and Condensed Matter Physics, having authored 192 papers that have together received 2.6k indexed citations. Recurring topics across this work include Semiconductor materials and devices (49 papers), Silicon Carbide Semiconductor Technologies (36 papers), Advanced DC-DC Converters (28 papers), 3D IC and TSV technologies (26 papers), Electronic Packaging and Soldering Technologies (26 papers), Electromagnetic Compatibility and Noise Suppression (21 papers), Semiconductor materials and interfaces (16 papers) and Thin-Film Transistor Technologies (14 papers). The work is most often cited by research in Electrical and Electronic Engineering (1.9k citations), Bioengineering (81 citations), Biomedical Engineering (531 citations), Aerospace Engineering (303 citations) and Mechanics of Materials (291 citations). Simon S. Ang has collaborated with scholars based in United States, Singapore and China. Frequent co-authors include S.K. Chou, Kaili Zhang, W.D. Brown, Wen‐Tso Liu, Liang Zhu, William D. Brown, Alejandro Oliva, Hameed A. Naseem, H. Alan Mantooth and Xiaosong Tang. Their work appears in journals such as Journal of Applied Physics, IEEE Transactions on Advanced Packaging, Journal of Electronic Materials, Solid-State Electronics and Thin Solid Films.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.