Sungjun Chun
Impact in
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- Electromagnetic Compatibility and Noise Suppression
- 3D IC and TSV technologies
- Electrostatic Discharge in Electronics
- Electromagnetic Compatibility and Measurements
- Electronic Packaging and Soldering Technologies
- Microwave Engineering and Waveguides
- Low-power high-performance VLSI design
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- Advanced Antenna and Metasurface Technologies
Papers in
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- Electromagnetic Compatibility and Noise Suppression 26
- 3D IC and TSV technologies 15
- Electronic Packaging and Soldering Technologies 7
- Advancements in PLL and VCO Technologies 6
- Electrostatic Discharge in Electronics 5
- Microwave Engineering and Waveguides 3
- Semiconductor Lasers and Optical Devices 3
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- VLSI and Analog Circuit Testing 4
- Co-authors
- Madhavan Swaminathan (10 shared papers)L.D. Smith (4 shared papers)M.K. Iyer (2 shared papers)Daniel Dreps (13 shared papers)Zhaoqing Chen (1 shared paper)Rao Tummala (1 shared paper)Robert Anderson (1 shared paper)Dale Becker (8 shared papers)
- Journals
- IEEE Transactions on Advanced Packaging (2 papers)IBM Journal of Research and Development (1 paper)Electrical Performance of Electronic Packaging (1 paper)IEEE International Symposium on Electromagnetic Compatibility (1 paper)
- Partner nations
- United StatesSingaporeGermany
In The Last Decade
Sungjun Chun
27 papers receiving 360 citations
Peers
Comparison fields: 5 of 30
- Electrical and Electronic Engineering 368
- Aerospace Engineering 86
- Hardware and Architecture 20
- Astronomy and Astrophysics 35
- Architecture 2
Countries citing papers authored by Sungjun Chun
This map shows the geographic impact of Sungjun Chun's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Sungjun Chun with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Sungjun Chun more than expected).
Fields of papers citing papers by Sungjun Chun
This network shows the impact of papers produced by Sungjun Chun. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Sungjun Chun. The network helps show where Sungjun Chun may publish in the future.
Co-authors
The 25 scholars most cited alongside Sungjun Chun, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.
All Works
Showing the 20 most-cited of 30 papers — load more, or switch the sort, to bring in the rest.
| # | Work | ||
|---|---|---|---|
| 1 | 2000 | 122 | |
| 2 | 2001 | 90 | |
| 3 | 2002 | 30 | |
| 4 | 2002 | 25 | |
| 5 | 2003 | 17 | |
| 6 | 2018 | 14 | |
| 7 | 2002 | 14 | |
| 8 | 2006 | 10 | |
| 9 | 2003 | 9 | |
| 10 | 2017 | 8 | |
| 11 | 2002 | 7 | |
| 12 | 2007 | 4 | |
| 13 | 2017 | 4 | |
| 14 | 2003 | 4 | |
| 15 | 2019 | 3 | |
| 16 | 2005 | 3 | |
| 17 | 2005 | 3 | |
| 18 | 2003 | 3 | |
| 19 | 2008 | 3 | |
| 20 | 2002 | 2 |
About Sungjun Chun
Sungjun Chun is a scholar working on Electrical and Electronic Engineering, Hardware and Architecture, Computer Networks and Communications, Astronomy and Astrophysics and Control and Systems Engineering, having authored 30 papers that have together received 384 indexed citations. Recurring topics across this work include Electromagnetic Compatibility and Noise Suppression (26 papers), 3D IC and TSV technologies (15 papers), Electronic Packaging and Soldering Technologies (7 papers), Advancements in PLL and VCO Technologies (6 papers), Electrostatic Discharge in Electronics (5 papers), VLSI and Analog Circuit Testing (4 papers), Microwave Engineering and Waveguides (3 papers) and Semiconductor Lasers and Optical Devices (3 papers). The work is most often cited by research in Electrical and Electronic Engineering (368 citations), Aerospace Engineering (86 citations), Hardware and Architecture (20 citations), Astronomy and Astrophysics (35 citations) and Architecture (2 citations). Sungjun Chun has collaborated with scholars based in United States, Singapore and Germany. Frequent co-authors include Madhavan Swaminathan, L.D. Smith, M.K. Iyer, Daniel Dreps, Zhaoqing Chen, Rao Tummala, Robert Anderson, Dale Becker, G. Edward White and Jose A. Hejase. Their work appears in journals such as IEEE Transactions on Advanced Packaging, IBM Journal of Research and Development, Electrical Performance of Electronic Packaging and IEEE International Symposium on Electromagnetic Compatibility.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.