Sebastian Brand
About
Sebastian Brand has authored 66 papers that have received a total of 552 indexed citations.
This includes 37 papers in Electrical and Electronic Engineering, 23 papers in Biomedical Engineering and 23 papers in Mechanics of Materials. The topics of these papers are Integrated Circuits and Semiconductor Failure Analysis (29 papers), Ultrasonics and Acoustic Wave Propagation (17 papers) and 3D IC and TSV technologies (10 papers). Sebastian Brand is often cited by papers focused on Integrated Circuits and Semiconductor Failure Analysis (29 papers), Ultrasonics and Acoustic Wave Propagation (17 papers) and 3D IC and TSV technologies (10 papers) and collaborates with scholars based in Germany, Canada and United States. Sebastian Brand's co-authors include Matthias Petzold, M. Wicke, Daniel Mörlein, Michael C. Kolios and Kay Raum and has published in prestigious journals such as Applied Physics Letters, Clinical Cancer Research and The Journal of the Acoustical Society of America.
In The Last Decade
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