Frank Altmann

1.6k citations

121 papers · 1.2k · h-index 19

Impact in

Structural Biology top 5%
Condensed Matter Physics top 10%
- GaN-based semiconductor devices and materials

Papers in

Electrical and Electronic Engineering 88
- Integrated Circuits and Semiconductor Failure Analysis 57
- Semiconductor materials and devices 24
- 3D IC and TSV technologies 11
Mechanics of Materials 39
- Thermography and Photoacoustic Techniques 29

Co-authors: Otwin Breitenstein (8 shared papers)Viktor Mechtcherine (5 shared papers)Christian Schmidt (10 shared papers)Matthias Petzold (15 shared papers)Andreas Graff (22 shared papers)Sebastian Brand (24 shared papers)Andreas Lindner (3 shared papers)O. Breitenstein (2 shared papers)
Journals: Microelectronics Reliability (16 papers)Microscopy and Microanalysis (5 papers)IEEE Transactions on Components Packaging and Manufacturing Technology (2 papers)Cement and Concrete Composites (2 papers)Materials and Structures (2 papers)
Partner nations: Germany United States France

In The Last Decade

Frank Altmann

113 papers receiving 1.1k citations

Peers

Countries citing papers authored by Frank Altmann

Since Specialization

Citations

This map shows the geographic impact of Frank Altmann's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Frank Altmann with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Frank Altmann more than expected).

Fields of papers citing papers by Frank Altmann

Since Specialization

Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers produced by Frank Altmann. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Frank Altmann. The network helps show where Frank Altmann may publish in the future.

Co-authors

The 25 scholars most cited alongside Frank Altmann, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.

Border = papers with Frank Altmann Line = papers co-authored together Frank Altmann links everyone, so they are left out of the graph.

All Works

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20 of 20 papers shown

Showing the 20 most-cited of 121 papers — load more, or switch the sort, to bring in the rest.

#	Work
1	Durability of strain-hardening cement-based composites (SHCC) Materials and Structures ·Gideon van Zijl, Folker H. Wittmann, Byung Hwan Oh, Petr Kabele, Romildo Dias Tolêdo Filho, Eduardo de Moraes Rego Fairbairn, Volker Slowik, Atsuhisa Ogawa, Hideki Hoshiro, Viktor Mechtcherine, Frank Altmann, Michael D. Lepech	2012	105
2	Microscopic lock-in thermography investigation of leakage sites in integrated circuits Review of Scientific Instruments ·Otwin Breitenstein, Martin Langenkamp, Frank Altmann, D. S. Katzer, Andreas Lindner, H. Eggers	2000	74
3	Improved AlScN/GaN heterostructures grown by metal-organic chemical vapor deposition Semiconductor Science and Technology ·C. Manz, Stefano Leone, Lutz Kirste, Jana Ligl, Kathrin Frei, Theodor Fuchs, Mario Prescher, Patrick Waltereit, Marcel A. Verheijen, Andreas Graff, M. Simon-Najasek, Frank Altmann, M. Fiederle, O. Ambacher	2021	62
4	Lock-In IR-Thermography – A Novel Tool for Material and Device Characterization Diffusion and defect data, solid state data. Part B, Solid state phenomena/Solid state phenomena ·S. Huth, Otwin Breitenstein, Arthur Huber, D. Dantz, U. Lambert, Frank Altmann	2001	58
5	Surface amorphization, sputter rate, and intrinsic stresses of silicon during low energy Ga+ focused-ion beam milling Nuclear Instruments and Methods in Physics Research Section B Beam Interactions with Materials and Atoms ·Lars Pastewka, Roland Salzer, Andreas Graff, Frank Altmann, Michael Moseler	2009	43
6	Application of lock-in thermography for failure analysis in integrated circuits using quantitative phase shift analysis Materials Science and Engineering B ·Ch. Schmidt, Frank Altmann, O. Breitenstein	2012	41
7	Non-destructive defect depth determination at fully packaged and stacked die devices using Lock-in Thermography Publikationsdatenbank der Fraunhofer-Gesellschaft (Fraunhofer-Gesellschaft) ·Christian Schmidt, Frank Altmann, Rudolf Schlangen, Hervé Deslandes	2010	32
8	3D Sensor application with open through silicon via technology Fraunhofer-Publica (Fraunhofer-Gesellschaft) ·Jochen Kraft, Franz Schrank, J. Teva, J. Siegert, Guenther Koppitsch, Cathal Cassidy, E. Wachmann, Frank Altmann, Sebastian Brand, Christian Schmidt, Matthias Petzold	2011	32
9	Characterization of thermo-mechanical stress and reliability issues for Cu-filled TSVs Fraunhofer-Publica (Fraunhofer-Gesellschaft) ·Dean Malta, Christopher W. Gregory, Matthew Lueck, D. Temple, Michael Krause, Frank Altmann, Matthias Petzold, Michael Weatherspoon, J. MICHAEL MILLER	2011	29
10	Challenges and Perspectives for Vertical GaN-on-Si Trench MOS Reliability: From Leakage Current Analysis to Gate Stack Optimization Materials ·Kalparupa Mukherjee, Carlo De Santi, Matteo Borga, Karen Geens, Shuzhen You, Benoit Bakeroot, Stefaan Decoutere, Patrick Diehle, S. Hübner, Frank Altmann, Matteo Buffolo, Gaudenzio Meneghesso, Enrico Zanoni, Matteo Meneghini	2021	28
11	Fast and Distributed Thermal Model for Thermal Modeling of GaN Power Devices IEEE Transactions on Components Packaging and Manufacturing Technology ·Vice Sodan, Steve Stoffels, Herman Oprins, Stefaan Decoutere, Frank Altmann, Martine Baelmans, Ingrid De Wolf	2018	26
12	Durability design strategies for new cementitious materials Cement and Concrete Research ·Frank Altmann, Viktor Mechtcherine	2013	26
13	Fault Localization and Functional Testing of ICs by Lock-in Thermography Proceedings - International Symposium for Testing and Failure Analysis ·Otwin Breitenstein, J.P. Rakotoniaina, Frank Altmann, Jürgen Schulz, G. Linse	2002	24
14	New Developments in IR Lock-In Thermography Proceedings - International Symposium for Testing and Failure Analysis ·Otwin Breitenstein, J.P. Rakotoniaina, M. Hejjo Al Rifai, Martin Gradhand, Frank Altmann, T. Riediger	2004	23
15	Lock-In-Thermography for 3-Dimensional Localization of Electrical Defects inside Complex Packaged Devices Proceedings - International Symposium for Testing and Failure Analysis ·Christian Schmidt, Frank Altmann, Christian U. Große, Andreas Lindner, V. H. Gottschalk	2008	23
16	Innovative Failure Analysis Techniques for 3-D Packaging Developments IEEE Design and Test ·Frank Altmann, Matthias Petzold	2016	21
17	Thermal Failure Analysis by IR Lock-in Thermography Max Planck Institute for Plasma Physics ·Otwin Breitenstein, Max Planck, Christian Schmidt, Frank Altmann, D. Karg	2011	21
18	A fuzzy-probabilistic durability concept for strain-hardening cement-based composites (SHCCs) exposed to chlorides Cement and Concrete Composites ·Frank Altmann, J.‐U. Sickert, Viktor Mechtcherine, Michael Kaliske	2012	21
19	Lock-in thermal IR imaging using a solid immersion lens Microelectronics Reliability ·Otwin Breitenstein, Frank Altmann, T. Riediger, D. Karg, V. H. Gottschalk	2006	21
20	A new approach for modelling the ingress of deleterious materials in cracked strain hardening cement-based composites Materials and Structures ·William P. Boshoff, Frank Altmann, Christo Johan Adendorff, Viktor Mechtcherine	2015	16

About Frank Altmann

Frank Altmann is a scholar working on Electrical and Electronic Engineering, Mechanics of Materials, Biomedical Engineering, Mechanical Engineering and Condensed Matter Physics, having authored 121 papers that have together received 1.2k indexed citations. Recurring topics across this work include Integrated Circuits and Semiconductor Failure Analysis (57 papers), Thermography and Photoacoustic Techniques (29 papers), Semiconductor materials and devices (24 papers), GaN-based semiconductor devices and materials (16 papers), Industrial Vision Systems and Defect Detection (15 papers), Electron and X-Ray Spectroscopy Techniques (15 papers), 3D IC and TSV technologies (11 papers) and Advanced Surface Polishing Techniques (10 papers). The work is most often cited by research in Structural Biology (34 citations), Condensed Matter Physics (170 citations), Mechanics of Materials (318 citations), Electrical and Electronic Engineering (695 citations) and Civil and Structural Engineering (187 citations). Frank Altmann has collaborated with scholars based in Germany, United States and France. Frequent co-authors include Otwin Breitenstein, Viktor Mechtcherine, Christian Schmidt, Matthias Petzold, Andreas Graff, Sebastian Brand, Andreas Lindner, O. Breitenstein, D. S. Katzer and Christian U. Große. Their work appears in journals such as Microelectronics Reliability, Microscopy and Microanalysis, IEEE Transactions on Components Packaging and Manufacturing Technology, Cement and Concrete Composites and Materials and Structures.

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.

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