A. Upham
Impact in
-
- Metal and Thin Film Mechanics
-
- Copper Interconnects and Reliability
Papers in
-
- Semiconductor materials and devices 4
- Electrical and Thermal Properties of Materials 1
- 3D IC and TSV technologies 1
-
- Metal and Thin Film Mechanics 3
- Co-authors
- Alain E. Kaloyeros (4 shared papers)Barry Arkles (4 shared papers)Cindy Goldberg (3 shared papers)Gregory M. Peterson (3 shared papers)D. Manger (2 shared papers)Ajit Paranjpe (2 shared papers)D. Boyd (1 shared paper)J.D. Schaub (1 shared paper)
- Journals
- Journal of The Electrochemical Society (2 papers)IEEE Electron Device Letters (1 paper)Journal of Vacuum Science & Technology B Microelectronics and Nanometer Structures Processing Measurement and Phenomena (1 paper)ChemInform (1 paper)
- Partner nations
- United States
In The Last Decade
A. Upham
5 papers receiving 110 citations
Peers
Comparison fields: 5 of 20
- Mechanics of Materials 52
- Electronic, Optical and Magnetic Materials 35
- Instrumentation 6
- Electrical and Electronic Engineering 94
- Condensed Matter Physics 9
Countries citing papers authored by A. Upham
This map shows the geographic impact of A. Upham's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by A. Upham with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites A. Upham more than expected).
Fields of papers citing papers by A. Upham
This network shows the impact of papers produced by A. Upham. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by A. Upham. The network helps show where A. Upham may publish in the future.
Co-authors
The 25 scholars most cited alongside A. Upham, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.
All Works
| # | Work | ||
|---|---|---|---|
| 1 | 2002 | 38 | |
| 2 | 1997 | 37 | |
| 3 | 2000 | 18 | |
| 4 | 1998 | 10 | |
| 5 | 2012 | 9 | |
| 6 | 1997 | 1 |
About A. Upham
A. Upham is a scholar working on Electrical and Electronic Engineering, Mechanics of Materials, Electronic, Optical and Magnetic Materials, Atomic and Molecular Physics, and Optics and Automotive Engineering, having authored 6 papers that have together received 113 indexed citations. Recurring topics across this work include Semiconductor materials and devices (4 papers), Metal and Thin Film Mechanics (3 papers), Copper Interconnects and Reliability (3 papers), Electrical and Thermal Properties of Materials (1 paper), 3D IC and TSV technologies (1 paper), Advanced Optical Sensing Technologies (1 paper), Semiconductor materials and interfaces (1 paper) and Additive Manufacturing and 3D Printing Technologies (1 paper). The work is most often cited by research in Mechanics of Materials (52 citations), Electronic, Optical and Magnetic Materials (35 citations), Instrumentation (6 citations), Electrical and Electronic Engineering (94 citations) and Condensed Matter Physics (9 citations). A. Upham has collaborated with scholars based in United States. Frequent co-authors include Alain E. Kaloyeros, Barry Arkles, Cindy Goldberg, Gregory M. Peterson, D. Manger, Ajit Paranjpe, D. Boyd, J.D. Schaub, James T. Marsh and J.J. Welser. Their work appears in journals such as Journal of The Electrochemical Society, IEEE Electron Device Letters, Journal of Vacuum Science & Technology B Microelectronics and Nanometer Structures Processing Measurement and Phenomena and ChemInform.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.