S.L. Shue
Impact in
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- Copper Interconnects and Reliability
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- Semiconductor materials and devices
- Electrodeposition and Electroless Coatings
- Electronic Packaging and Soldering Technologies
Papers in
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- Semiconductor materials and devices 12
- Electrodeposition and Electroless Coatings 4
- 3D IC and TSV technologies 3
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- Copper Interconnects and Reliability 16
- Co-authors
- Chun-Hsing Shih (3 shared papers)Chiapyng Lee (3 shared papers)Ming-Hsien Tsai (3 shared papers)Yu‐Lin Kuo (3 shared papers)Mong-Song Liang (3 shared papers)Jing‐Cheng Lin (2 shared papers)Bau‐Tong Dai (1 shared paper)C.C. Wan (2 shared papers)
- Journals
- Electrochemical and Solid-State Letters (3 papers)Journal of The Electrochemical Society (2 papers)ACS Applied Nano Materials (2 papers)Thin Solid Films (1 paper)Japanese Journal of Applied Physics (1 paper)
- Partner nations
- TaiwanUnited StatesNetherlands
In The Last Decade
S.L. Shue
20 papers receiving 139 citations
Peers
Comparison fields: 5 of 19
- Electronic, Optical and Magnetic Materials 79
- Electrical and Electronic Engineering 117
- Mechanics of Materials 31
- Materials Chemistry 49
- Atomic and Molecular Physics, and Optics 26
Countries citing papers authored by S.L. Shue
This map shows the geographic impact of S.L. Shue's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by S.L. Shue with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites S.L. Shue more than expected).
Fields of papers citing papers by S.L. Shue
This network shows the impact of papers produced by S.L. Shue. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by S.L. Shue. The network helps show where S.L. Shue may publish in the future.
Co-authors
The 25 scholars most cited alongside S.L. Shue, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.
All Works
Showing the 20 most-cited of 21 papers — load more, or switch the sort, to bring in the rest.
| # | Work | ||
|---|---|---|---|
| 1 | 2003 | 29 | |
| 2 | 2004 | 26 | |
| 3 | 2006 | 17 | |
| 4 | 2004 | 10 | |
| 5 | 2002 | 9 | |
| 6 | 2001 | 8 | |
| 7 | 2003 | 8 | |
| 8 | 2023 | 7 | |
| 9 | 2021 | 4 | |
| 10 | 1991 | 4 | |
| 11 | 2023 | 3 | |
| 12 | 2009 | 3 | |
| 13 | 2007 | 3 | |
| 14 | 2003 | 3 | |
| 15 | 2009 | 2 | |
| 16 | 2017 | 2 | |
| 17 | 2002 | 2 | |
| 18 | 2017 | 2 | |
| 19 | 2011 | 2 | |
| 20 | 2003 | 1 |
About S.L. Shue
S.L. Shue is a scholar working on Electrical and Electronic Engineering, Electronic, Optical and Magnetic Materials, Materials Chemistry, Mechanics of Materials and Atomic and Molecular Physics, and Optics, having authored 21 papers that have together received 145 indexed citations. Recurring topics across this work include Copper Interconnects and Reliability (16 papers), Semiconductor materials and devices (12 papers), Metal and Thin Film Mechanics (6 papers), Electrodeposition and Electroless Coatings (4 papers), 3D IC and TSV technologies (3 papers), Graphene research and applications (3 papers), Nanoporous metals and alloys (2 papers) and Semiconductor materials and interfaces (2 papers). The work is most often cited by research in Electronic, Optical and Magnetic Materials (79 citations), Electrical and Electronic Engineering (117 citations), Mechanics of Materials (31 citations), Materials Chemistry (49 citations) and Atomic and Molecular Physics, and Optics (26 citations). S.L. Shue has collaborated with scholars based in Taiwan, United States and Netherlands. Frequent co-authors include Chun-Hsing Shih, Chiapyng Lee, Ming-Hsien Tsai, Yu‐Lin Kuo, Mong-Song Liang, Jing‐Cheng Lin, Bau‐Tong Dai, C.C. Wan, Shih-Chieh Chang and M.S. Liang. Their work appears in journals such as Electrochemical and Solid-State Letters, Journal of The Electrochemical Society, ACS Applied Nano Materials, Thin Solid Films and Japanese Journal of Applied Physics.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.