IEEE Transactions on Components Packaging and Manufacturing Technology

3.1k papers and 31.5k indexed citations i.

About

The 3.1k papers published in IEEE Transactions on Components Packaging and Manufacturing Technology in the last decades have received a total of 31.5k indexed citations. Papers published in IEEE Transactions on Components Packaging and Manufacturing Technology usually cover Electrical and Electronic Engineering (2.5k papers), Mechanical Engineering (719 papers) and Biomedical Engineering (437 papers) specifically the topics of 3D IC and TSV technologies (950 papers), Electronic Packaging and Soldering Technologies (895 papers) and Electromagnetic Compatibility and Noise Suppression (552 papers). The most active scholars publishing in IEEE Transactions on Components Packaging and Manufacturing Technology are John H. Lau, Kuan Yew Cheong, Vemal Raja Manikam, Madhavan Swaminathan, Rao Tummala, Muhannad S. Bakir, Ashraf Uz Zaman, Per-Simon Kildal, Guo‐Quan Lu and Lei Zhu.

In The Last Decade

Fields of papers published in IEEE Transactions on Components Packaging and Manufacturing Technology

Since Specialization
Physical SciencesHealth SciencesLife SciencesSocial Sciences

This network shows the impact of papers published in IEEE Transactions on Components Packaging and Manufacturing Technology. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers published in IEEE Transactions on Components Packaging and Manufacturing Technology.

Countries where authors publish in IEEE Transactions on Components Packaging and Manufacturing Technology

Since Specialization
Citations

This map shows the geographic impact of research published in IEEE Transactions on Components Packaging and Manufacturing Technology. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by papers published in IEEE Transactions on Components Packaging and Manufacturing Technology with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites IEEE Transactions on Components Packaging and Manufacturing Technology more than expected).

Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar’s output or impact.

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