Bernard Flechet
Impact in
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- 3D IC and TSV technologies
- Semiconductor materials and devices
- Microwave Engineering and Waveguides
- Microwave and Dielectric Measurement Techniques
- Radio Frequency Integrated Circuit Design
- VLSI and FPGA Design Techniques
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- Copper Interconnects and Reliability
Papers in
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- Copper Interconnects and Reliability 38
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- 3D IC and TSV technologies 33
- Semiconductor materials and devices 18
- Microwave Engineering and Waveguides 13
- Microwave and Dielectric Measurement Techniques 10
- VLSI and FPGA Design Techniques 4
- Electromagnetic Compatibility and Noise Suppression 3
- Co-authors
- C. Bermond (70 shared papers)A. Farcy (63 shared papers)T. Lacrevaz (62 shared papers)Philip R. LeDuc (13 shared papers)P. Ancey (12 shared papers)Philippe Ferrari (3 shared papers)T. Bertaud (8 shared papers)Mickael Gros-Jean (7 shared papers)
In The Last Decade
Bernard Flechet
85 papers receiving 587 citations
Peers
Comparison fields: 5 of 22
- Electrical and Electronic Engineering 531
- Electronic, Optical and Magnetic Materials 81
- Hardware and Architecture 14
- Materials Chemistry 39
- Computer Networks and Communications 11
Countries citing papers authored by Bernard Flechet
This map shows the geographic impact of Bernard Flechet's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Bernard Flechet with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Bernard Flechet more than expected).
Fields of papers citing papers by Bernard Flechet
This network shows the impact of papers produced by Bernard Flechet. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Bernard Flechet. The network helps show where Bernard Flechet may publish in the future.
Co-authors
The 25 scholars most cited alongside Bernard Flechet, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.
All Works
Showing the 20 most-cited of 91 papers — load more, or switch the sort, to bring in the rest.
| # | Work | ||
|---|---|---|---|
| 1 | 2009 | 52 | |
| 2 | 2010 | 45 | |
| 3 | 2009 | 36 | |
| 4 | 1994 | 31 | |
| 5 | 2010 | 29 | |
| 6 | 2009 | 20 | |
| 7 | 2012 | 20 | |
| 8 | 2009 | 19 | |
| 9 | 2010 | 19 | |
| 10 | 2012 | 19 | |
| 11 | 2014 | 19 | |
| 12 | 2009 | 17 | |
| 13 | 2002 | 14 | |
| 14 | 2013 | 14 | |
| 15 | 2006 | 13 | |
| 16 | 2009 | 12 | |
| 17 | 2011 | 11 | |
| 18 | 2010 | 10 | |
| 19 | 2010 | 10 | |
| 20 | 2005 | 9 |
About Bernard Flechet
Bernard Flechet is a scholar working on Electronic, Optical and Magnetic Materials, Electrical and Electronic Engineering, Computer Networks and Communications, Materials Chemistry and Biomedical Engineering, having authored 91 papers that have together received 618 indexed citations. Recurring topics across this work include Copper Interconnects and Reliability (38 papers), 3D IC and TSV technologies (33 papers), Semiconductor materials and devices (18 papers), Microwave Engineering and Waveguides (13 papers), Microwave and Dielectric Measurement Techniques (10 papers), VLSI and FPGA Design Techniques (4 papers), Interconnection Networks and Systems (4 papers) and Electromagnetic Compatibility and Noise Suppression (3 papers). The work is most often cited by research in Electrical and Electronic Engineering (531 citations), Electronic, Optical and Magnetic Materials (81 citations), Hardware and Architecture (14 citations), Materials Chemistry (39 citations) and Computer Networks and Communications (11 citations). Bernard Flechet has collaborated with scholars based in France, Germany and Australia. Frequent co-authors include C. Bermond, A. Farcy, T. Lacrevaz, Philip R. LeDuc, P. Ancey, Philippe Ferrari, T. Bertaud, Mickael Gros-Jean, Christine Fuchs and S. Blonkowski. Their work appears in journals such as Microelectronic Engineering, IEEE Transactions on Components Packaging and Manufacturing Technology, Journal of Applied Physics, Electronics Letters and IEEE Electron Device Letters.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.