Jay Im
Impact in
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- 3D IC and TSV technologies
- Electronic Packaging and Soldering Technologies
- Advancements in PLL and VCO Technologies
- Semiconductor materials and devices
- Radio Frequency Integrated Circuit Design
- Integrated Circuits and Semiconductor Failure Analysis
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- Copper Interconnects and Reliability
Papers in
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- 3D IC and TSV technologies 36
- Electronic Packaging and Soldering Technologies 35
- Advancements in PLL and VCO Technologies 19
- Semiconductor materials and devices 17
- Radio Frequency Integrated Circuit Design 15
- Integrated Circuits and Semiconductor Failure Analysis 10
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- Advanced Surface Polishing Techniques 15
- Co-authors
- Paul S. Ho (49 shared papers)Rui Huang (28 shared papers)Suk-Kyu Ryu (10 shared papers)Kuan Lu (8 shared papers)Tengfei Jiang (19 shared papers)Seung‐Hyun Chae (8 shared papers)Kuan-Hsun Lu (6 shared papers)Xuefeng Zhang (5 shared papers)
- Journals
- IEEE Journal of Solid-State Circuits (7 papers)Journal of Applied Physics (4 papers)IEEE Transactions on Device and Materials Reliability (3 papers)Applied Physics Letters (2 papers)Microelectronics Reliability (1 paper)
- Partner nations
- United StatesSouth KoreaGermany
In The Last Decade
Jay Im
79 papers receiving 1.9k citations
Peers
Comparison fields: 5 of 67
- Electrical and Electronic Engineering 1.8k
- Electronic, Optical and Magnetic Materials 295
- Hardware and Architecture 72
- Biomedical Engineering 408
- Automotive Engineering 114
Countries citing papers authored by Jay Im
This map shows the geographic impact of Jay Im's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Jay Im with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Jay Im more than expected).
Fields of papers citing papers by Jay Im
This network shows the impact of papers produced by Jay Im. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Jay Im. The network helps show where Jay Im may publish in the future.
Co-authors
The 25 scholars most cited alongside Jay Im, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.
All Works
Showing the 20 most-cited of 82 papers — load more, or switch the sort, to bring in the rest.
| # | Work | ||
|---|---|---|---|
| 1 | 2009 | 182 | |
| 2 | 2007 | 176 | |
| 3 | 2017 | 131 | |
| 4 | 2010 | 105 | |
| 5 | 2006 | 100 | |
| 6 | 2012 | 100 | |
| 7 | 2012 | 97 | |
| 8 | 2012 | 96 | |
| 9 | 2013 | 61 | |
| 10 | 2015 | 55 | |
| 11 | 2010 | 51 | |
| 12 | 2012 | 49 | |
| 13 | 2017 | 49 | |
| 14 | 2018 | 43 | |
| 15 | 2017 | 38 | |
| 16 | 2018 | 35 | |
| 17 | 2016 | 35 | |
| 18 | 2015 | 34 | |
| 19 | 2013 | 28 | |
| 20 | 2011 | 27 |
About Jay Im
Jay Im is a scholar working on Electrical and Electronic Engineering, Biomedical Engineering, Electronic, Optical and Magnetic Materials, Mechanical Engineering and Hardware and Architecture, having authored 82 papers that have together received 2.0k indexed citations. Recurring topics across this work include 3D IC and TSV technologies (36 papers), Electronic Packaging and Soldering Technologies (35 papers), Advancements in PLL and VCO Technologies (19 papers), Semiconductor materials and devices (17 papers), Copper Interconnects and Reliability (17 papers), Advanced Surface Polishing Techniques (15 papers), Radio Frequency Integrated Circuit Design (15 papers) and Integrated Circuits and Semiconductor Failure Analysis (10 papers). The work is most often cited by research in Electrical and Electronic Engineering (1.8k citations), Electronic, Optical and Magnetic Materials (295 citations), Hardware and Architecture (72 citations), Biomedical Engineering (408 citations) and Automotive Engineering (114 citations). Jay Im has collaborated with scholars based in United States, South Korea and Germany. Frequent co-authors include Paul S. Ho, Rui Huang, Suk-Kyu Ryu, Kuan Lu, Tengfei Jiang, Seung‐Hyun Chae, Kuan-Hsun Lu, Xuefeng Zhang, Qiu Zhao and Brook Chao. Their work appears in journals such as IEEE Journal of Solid-State Circuits, Journal of Applied Physics, IEEE Transactions on Device and Materials Reliability, Applied Physics Letters and Microelectronics Reliability.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.