Jong-ook Suh
Impact in
- Automotive Engineering top 1%
- Additive Manufacturing and 3D Printing Technologies
- Mechanical Engineering top 1%
- Additive Manufacturing Materials and Processes
- High Entropy Alloys Studies
- Intermetallics and Advanced Alloy Properties
- Welding Techniques and Residual Stresses
Papers in
-
- Electronic Packaging and Soldering Technologies 20
- 3D IC and TSV technologies 15
-
- Additive Manufacturing Materials and Processes 4
- Intermetallics and Advanced Alloy Properties 4
- Aluminum Alloys Composites Properties 2
- Advanced Welding Techniques Analysis 2
- Co-authors
- K. N. Tu (12 shared papers)R. Peter Dillon (6 shared papers)Douglas C. Hofmann (5 shared papers)Zi‐Kui Liu (4 shared papers)Richard Otis (4 shared papers)Andrew A. Shapiro (4 shared papers)John Paul Borgonia (2 shared papers)Jae-Woong Nah (8 shared papers)
- Journals
- Journal of Applied Physics (5 papers)Applied Physics Letters (2 papers)Scientific Reports (2 papers)Acta Materialia (2 papers)IEEE Transactions on Plasma Science (1 paper)
- Partner nations
- United StatesSingaporeItaly
In The Last Decade
Jong-ook Suh
27 papers receiving 1.7k citations
Jong-ook Suh's Hit Papers
Peers
Comparison fields: 5 of 56
- Automotive Engineering 589
- Mechanical Engineering 1.3k
- Electronic, Optical and Magnetic Materials 246
- Electrical and Electronic Engineering 731
- General Materials Science 33
Countries citing papers authored by Jong-ook Suh
This map shows the geographic impact of Jong-ook Suh's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Jong-ook Suh with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Jong-ook Suh more than expected).
Fields of papers citing papers by Jong-ook Suh
This network shows the impact of papers produced by Jong-ook Suh. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Jong-ook Suh. The network helps show where Jong-ook Suh may publish in the future.
Co-authors
The 25 scholars most cited alongside Jong-ook Suh, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.
All Works
Showing the 20 most-cited of 29 papers — load more, or switch the sort, to bring in the rest.
| # | Work | ||
|---|---|---|---|
| 1 | Functionally graded material of 304L stainless steel and inconel 625 fabricated by directed energy deposition: Characterization and thermodynamic modeling Hit paper breakdown → | 2016 | 525 |
| 2 | 2014 | 272 | |
| 3 | 2014 | 207 | |
| 4 | 2003 | 130 | |
| 5 | 2008 | 107 | |
| 6 | 2007 | 91 | |
| 7 | 2006 | 88 | |
| 8 | 2005 | 75 | |
| 9 | 2007 | 66 | |
| 10 | 2016 | 62 | |
| 11 | 2005 | 38 | |
| 12 | 2007 | 27 | |
| 13 | 2005 | 24 | |
| 14 | 2013 | 20 | |
| 15 | 2006 | 13 | |
| 16 | 2005 | 8 | |
| 17 | 2011 | 7 | |
| 18 | 2005 | 7 | |
| 19 | 2006 | 5 | |
| 20 | 2022 | 3 |
About Jong-ook Suh
Jong-ook Suh is a scholar working on Electrical and Electronic Engineering, Mechanical Engineering, Electronic, Optical and Magnetic Materials, Automotive Engineering and Materials Chemistry, having authored 29 papers that have together received 1.8k indexed citations. Recurring topics across this work include Electronic Packaging and Soldering Technologies (20 papers), 3D IC and TSV technologies (15 papers), Copper Interconnects and Reliability (7 papers), Additive Manufacturing Materials and Processes (4 papers), Additive Manufacturing and 3D Printing Technologies (4 papers), Intermetallics and Advanced Alloy Properties (4 papers), Aluminum Alloys Composites Properties (2 papers) and Advanced Welding Techniques Analysis (2 papers). The work is most often cited by research in Automotive Engineering (589 citations), Mechanical Engineering (1.3k citations), Electronic, Optical and Magnetic Materials (246 citations), Electrical and Electronic Engineering (731 citations) and General Materials Science (33 citations). Jong-ook Suh has collaborated with scholars based in United States, Singapore and Italy. Frequent co-authors include K. N. Tu, R. Peter Dillon, Douglas C. Hofmann, Zi‐Kui Liu, Richard Otis, Andrew A. Shapiro, John Paul Borgonia, Jae-Woong Nah, Nobumichi Tamura and Scott Roberts. Their work appears in journals such as Journal of Applied Physics, Applied Physics Letters, Scientific Reports, Acta Materialia and IEEE Transactions on Plasma Science.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.