B. Briggs
Impact in
-
- Semiconductor materials and devices
- Advancements in Semiconductor Devices and Circuit Design
- Integrated Circuits and Semiconductor Failure Analysis
- Ferroelectric and Negative Capacitance Devices
- 3D IC and TSV technologies
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- Copper Interconnects and Reliability
Papers in
-
- Semiconductor materials and devices 10
- 3D IC and TSV technologies 5
- Advancements in Semiconductor Devices and Circuit Design 5
- Thin-Film Transistor Technologies 2
- Low-power high-performance VLSI design 2
- Integrated Circuits and Semiconductor Failure Analysis 2
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- Copper Interconnects and Reliability 5
- Co-authors
- Edmund Y.S. Chao (1 shared paper)Chen Wu (1 shared paper)A. Leśniewska (1 shared paper)Christoph Adelmann (1 shared paper)Zs. Tôkei (2 shared papers)N. Jourdan (1 shared paper)Kristof Croes (1 shared paper)Olalla Varela Pedreira (1 shared paper)
- Journals
- IEEE Transactions on Electron Devices (1 paper)Materials science forum (1 paper)2022 International Electron Devices Meeting (IEDM) (1 paper)Symposium on VLSI Technology (1 paper)PubMed (1 paper)
- Partner nations
- BelgiumUnited StatesGermany
In The Last Decade
B. Briggs
14 papers receiving 355 citations
Peers
Comparison fields: 5 of 35
- Electrical and Electronic Engineering 268
- Electronic, Optical and Magnetic Materials 59
- Epidemiology 68
- Nuclear Energy and Engineering 1
- Surgery 66
Countries citing papers authored by B. Briggs
This map shows the geographic impact of B. Briggs's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by B. Briggs with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites B. Briggs more than expected).
Fields of papers citing papers by B. Briggs
This network shows the impact of papers produced by B. Briggs. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by B. Briggs. The network helps show where B. Briggs may publish in the future.
Co-authors
The 25 scholars most cited alongside B. Briggs, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.
All Works
| # | Work | ||
|---|---|---|---|
| 1 | 2020 | 90 | |
| 2 | The mechanical performance of the standard Hoffmann-Vidal external fixation apparatus. | 1982 | 79 |
| 3 | 2017 | 66 | |
| 4 | 2021 | 32 | |
| 5 | 2022 | 27 | |
| 6 | Forksheet FETs for Advanced CMOS Scaling: Forksheet-Nanosheet Co-Integration and Dual Work Function Metal Gates at 17nm N-P Space | 2021 | 17 |
| 7 | 2022 | 16 | |
| 8 | 2020 | 14 | |
| 9 | 2019 | 13 | |
| 10 | 2017 | 9 | |
| 11 | 2021 | 4 | |
| 12 | 2022 | 4 | |
| 13 | 2020 | 1 | |
| 14 | 2024 | 1 | |
| 15 | 2018 | 1 | |
| 16 | 2026 | 0 |
About B. Briggs
B. Briggs is a scholar working on Electrical and Electronic Engineering, Electronic, Optical and Magnetic Materials, Atomic and Molecular Physics, and Optics, Rehabilitation and Surfaces, Coatings and Films, having authored 16 papers that have together received 374 indexed citations. Recurring topics across this work include Semiconductor materials and devices (10 papers), 3D IC and TSV technologies (5 papers), Advancements in Semiconductor Devices and Circuit Design (5 papers), Copper Interconnects and Reliability (5 papers), Thin-Film Transistor Technologies (2 papers), Low-power high-performance VLSI design (2 papers), Integrated Circuits and Semiconductor Failure Analysis (2 papers) and Semiconductor materials and interfaces (2 papers). The work is most often cited by research in Electrical and Electronic Engineering (268 citations), Electronic, Optical and Magnetic Materials (59 citations), Epidemiology (68 citations), Nuclear Energy and Engineering (1 citation) and Surgery (66 citations). B. Briggs has collaborated with scholars based in Belgium, United States and Germany. Frequent co-authors include Edmund Y.S. Chao, Chen Wu, A. Leśniewska, Christoph Adelmann, Zs. Tôkei, N. Jourdan, Kristof Croes, Olalla Varela Pedreira, Marleen H. van der Veen and Joke De Messemaeker. Their work appears in journals such as IEEE Transactions on Electron Devices, Materials science forum, 2022 International Electron Devices Meeting (IEDM), Symposium on VLSI Technology and PubMed.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.