Fei Ren
Impact in
- Materials Chemistry top 5%
- Advanced Thermoelectric Materials and Devices
- Thermal properties of materials
- Automotive Engineering top 5%
- Advanced Battery Technologies Research
Papers in
-
- Advanced Thermoelectric Materials and Devices 27
- Thermal properties of materials 15
-
- Electronic Packaging and Soldering Technologies 12
- Chalcogenide Semiconductor Thin Films 7
- Co-authors
- Eldon D. Case (27 shared papers)Hsin Wang (7 shared papers)Haoqi Li (17 shared papers)E. J. Timm (13 shared papers)Melissa J. Baumann (5 shared papers)Yao Zhao (15 shared papers)Jy-An John Wang (11 shared papers)K. N. Tu (6 shared papers)
- Journals
- Scientific Reports (5 papers)The Philosophical Magazine A Journal of Theoretical Experimental and Applied Physics (5 papers)Journal of Electronic Materials (4 papers)Journal of Materials Science (4 papers)Applied Physics Letters (4 papers)
- Partner nations
- United StatesChinaSingapore
In The Last Decade
Fei Ren
109 papers receiving 2.3k citations
Peers
Comparison fields: 5 of 120
- Materials Chemistry 950
- Automotive Engineering 223
- Polymers and Plastics 216
- Electronic, Optical and Magnetic Materials 282
- Surfaces, Coatings and Films 108
Countries citing papers authored by Fei Ren
This map shows the geographic impact of Fei Ren's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Fei Ren with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Fei Ren more than expected).
Fields of papers citing papers by Fei Ren
This network shows the impact of papers produced by Fei Ren. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Fei Ren. The network helps show where Fei Ren may publish in the future.
Co-authors
The 25 scholars most cited alongside Fei Ren, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.
All Works
Showing the 20 most-cited of 115 papers — load more, or switch the sort, to bring in the rest.
| # | Work | ||
|---|---|---|---|
| 1 | 2006 | 102 | |
| 2 | 2017 | 89 | |
| 3 | 2022 | 83 | |
| 4 | 2013 | 77 | |
| 5 | 2013 | 68 | |
| 6 | 2005 | 68 | |
| 7 | 2008 | 60 | |
| 8 | 2023 | 59 | |
| 9 | 2009 | 58 | |
| 10 | 2020 | 56 | |
| 11 | 2011 | 55 | |
| 12 | 2017 | 51 | |
| 13 | 2016 | 50 | |
| 14 | 2007 | 49 | |
| 15 | 2007 | 46 | |
| 16 | 2022 | 43 | |
| 17 | 2012 | 42 | |
| 18 | 2014 | 41 | |
| 19 | 2014 | 41 | |
| 20 | 2013 | 41 |
About Fei Ren
Fei Ren is a scholar working on Materials Chemistry, Electrical and Electronic Engineering, Mechanical Engineering, Civil and Structural Engineering and Mechanics of Materials, having authored 115 papers that have together received 2.3k indexed citations. Recurring topics across this work include Advanced Thermoelectric Materials and Devices (27 papers), Thermal properties of materials (15 papers), Thermal Radiation and Cooling Technologies (12 papers), Electronic Packaging and Soldering Technologies (12 papers), Polymer Surface Interaction Studies (10 papers), Chalcogenide Semiconductor Thin Films (7 papers), Copper Interconnects and Reliability (7 papers) and Conducting polymers and applications (7 papers). The work is most often cited by research in Materials Chemistry (950 citations), Automotive Engineering (223 citations), Polymers and Plastics (216 citations), Electronic, Optical and Magnetic Materials (282 citations) and Surfaces, Coatings and Films (108 citations). Fei Ren has collaborated with scholars based in United States, China and Singapore. Frequent co-authors include Eldon D. Case, Hsin Wang, Haoqi Li, E. J. Timm, Melissa J. Baumann, Yao Zhao, Jy-An John Wang, K. N. Tu, Bosen Qian and Harold Schock. Their work appears in journals such as Scientific Reports, The Philosophical Magazine A Journal of Theoretical Experimental and Applied Physics, Journal of Electronic Materials, Journal of Materials Science and Applied Physics Letters.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.