Min Miao
Impact in
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- 3D IC and TSV technologies
- Electronic Packaging and Soldering Technologies
- Semiconductor materials and devices
- Electrical and Thermal Properties of Materials
- Electromagnetic Compatibility and Noise Suppression
- Automotive Engineering top 10%
- Additive Manufacturing and 3D Printing Technologies
Papers in
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- 3D IC and TSV technologies 78
- Electronic Packaging and Soldering Technologies 45
- Electrical and Thermal Properties of Materials 21
- Semiconductor materials and devices 17
- Electromagnetic Compatibility and Noise Suppression 16
- Microwave Engineering and Waveguides 14
- Advanced MEMS and NEMS Technologies 13
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- Ferroelectric and Piezoelectric Materials 12
- Co-authors
- Yufeng Jin (43 shared papers)Yufeng Jin (30 shared papers)Jin‐Ku Liu (5 shared papers)Shenglin Ma (22 shared papers)Jing Chen (7 shared papers)Yangfei Zhang (7 shared papers)Xiaole Cui (9 shared papers)Yi Lu (1 shared paper)
In The Last Decade
Min Miao
132 papers receiving 725 citations
Peers
Comparison fields: 5 of 60
- Electrical and Electronic Engineering 556
- Automotive Engineering 59
- Materials Chemistry 176
- Hardware and Architecture 22
- Ceramics and Composites 15
Countries citing papers authored by Min Miao
This map shows the geographic impact of Min Miao's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Min Miao with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Min Miao more than expected).
Fields of papers citing papers by Min Miao
This network shows the impact of papers produced by Min Miao. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Min Miao. The network helps show where Min Miao may publish in the future.
Co-authors
The 25 scholars most cited alongside Min Miao, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.
All Works
Showing the 20 most-cited of 144 papers — load more, or switch the sort, to bring in the rest.
| # | Work | ||
|---|---|---|---|
| 1 | 2017 | 38 | |
| 2 | 2017 | 33 | |
| 3 | 2018 | 31 | |
| 4 | 2013 | 31 | |
| 5 | 2008 | 30 | |
| 6 | 2017 | 23 | |
| 7 | 2015 | 20 | |
| 8 | 2018 | 19 | |
| 9 | 2015 | 15 | |
| 10 | 2007 | 14 | |
| 11 | 2021 | 13 | |
| 12 | 2023 | 13 | |
| 13 | 2009 | 13 | |
| 14 | 2016 | 12 | |
| 15 | 2010 | 12 | |
| 16 | 2009 | 11 | |
| 17 | 2011 | 11 | |
| 18 | 2018 | 10 | |
| 19 | 2023 | 10 | |
| 20 | 2008 | 9 |
About Min Miao
Min Miao is a scholar working on Electrical and Electronic Engineering, Materials Chemistry, Biomedical Engineering, Atomic and Molecular Physics, and Optics and Automotive Engineering, having authored 144 papers that have together received 747 indexed citations. Recurring topics across this work include 3D IC and TSV technologies (78 papers), Electronic Packaging and Soldering Technologies (45 papers), Electrical and Thermal Properties of Materials (21 papers), Semiconductor materials and devices (17 papers), Electromagnetic Compatibility and Noise Suppression (16 papers), Microwave Engineering and Waveguides (14 papers), Advanced MEMS and NEMS Technologies (13 papers) and Ferroelectric and Piezoelectric Materials (12 papers). The work is most often cited by research in Electrical and Electronic Engineering (556 citations), Automotive Engineering (59 citations), Materials Chemistry (176 citations), Hardware and Architecture (22 citations) and Ceramics and Composites (15 citations). Min Miao has collaborated with scholars based in China, Singapore and Egypt. Frequent co-authors include Yufeng Jin, Yufeng Jin, Jin‐Ku Liu, Shenglin Ma, Jing Chen, Yangfei Zhang, Xiaole Cui, Yi Lu, Yanan Xue and Shulin Bai. Their work appears in journals such as ACS Applied Materials & Interfaces, Dyes and Pigments, Microelectronic Engineering, Journal of Nanoelectronics and Optoelectronics and International Journal of Heat and Mass Transfer.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.