P. Elenius
Impact in
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- Copper Interconnects and Reliability
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- Electronic Packaging and Soldering Technologies
- 3D IC and TSV technologies
- Integrated Circuits and Semiconductor Failure Analysis
Papers in
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- Electronic Packaging and Soldering Technologies 26
- 3D IC and TSV technologies 23
- Silicon and Solar Cell Technologies 4
- Integrated Circuits and Semiconductor Failure Analysis 4
- Green IT and Sustainability 2
- Advancements in Semiconductor Devices and Circuit Design 2
- Electromagnetic Compatibility and Noise Suppression 2
- Co-authors
- H. Balkan (5 shared papers)Woon‐Seop Choi (2 shared papers)Everett C. C. Yeh (2 shared papers)K. N. Tu (1 shared paper)K. N. Tu (3 shared papers)Scott Barrett (7 shared papers)T. T. Sheng (1 shared paper)D. R. Frear (1 shared paper)
- Journals
- Applied Physics Letters (1 paper)IEEE Transactions on Electronics Packaging Manufacturing (1 paper)Journal of Applied Physics (1 paper)Journal of materials research/Pratt's guide to venture capital sources (1 paper)Microelectronics Reliability (1 paper)
- Partner nations
- United StatesItalySingapore
In The Last Decade
P. Elenius
24 papers receiving 674 citations
Peers
Comparison fields: 5 of 25
- Electronic, Optical and Magnetic Materials 231
- Electrical and Electronic Engineering 718
- General Materials Science 33
- Mechanical Engineering 272
- Aerospace Engineering 43
Countries citing papers authored by P. Elenius
This map shows the geographic impact of P. Elenius's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by P. Elenius with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites P. Elenius more than expected).
Fields of papers citing papers by P. Elenius
This network shows the impact of papers produced by P. Elenius. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by P. Elenius. The network helps show where P. Elenius may publish in the future.
Co-authors
The 25 scholars most cited alongside P. Elenius, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.
All Works
Showing the 20 most-cited of 27 papers — load more, or switch the sort, to bring in the rest.
| # | Work | ||
|---|---|---|---|
| 1 | 2002 | 301 | |
| 2 | 2000 | 99 | |
| 3 | 2002 | 78 | |
| 4 | 2003 | 35 | |
| 5 | 2002 | 30 | |
| 6 | 2000 | 25 | |
| 7 | Wafer bumping technologies-A comparative analysis of solder deposition processes and assembly considerations. | 1997 | 24 |
| 8 | 2003 | 21 | |
| 9 | 2002 | 14 | |
| 10 | 2002 | 14 | |
| 11 | 2003 | 14 | |
| 12 | 2003 | 13 | |
| 13 | 2003 | 13 | |
| 14 | 2002 | 9 | |
| 15 | 2002 | 7 | |
| 16 | 2002 | 7 | |
| 17 | 2003 | 7 | |
| 18 | 1999 | 4 | |
| 19 | 2002 | 4 | |
| 20 | 2002 | 4 |
About P. Elenius
P. Elenius is a scholar working on Electrical and Electronic Engineering, Mechanics of Materials, Mechanical Engineering, Electronic, Optical and Magnetic Materials and Aerospace Engineering, having authored 27 papers that have together received 734 indexed citations. Recurring topics across this work include Electronic Packaging and Soldering Technologies (26 papers), 3D IC and TSV technologies (23 papers), Silicon and Solar Cell Technologies (4 papers), Integrated Circuits and Semiconductor Failure Analysis (4 papers), Copper Interconnects and Reliability (3 papers), Green IT and Sustainability (2 papers), Advancements in Semiconductor Devices and Circuit Design (2 papers) and Electromagnetic Compatibility and Noise Suppression (2 papers). The work is most often cited by research in Electronic, Optical and Magnetic Materials (231 citations), Electrical and Electronic Engineering (718 citations), General Materials Science (33 citations), Mechanical Engineering (272 citations) and Aerospace Engineering (43 citations). P. Elenius has collaborated with scholars based in United States, Italy and Singapore. Frequent co-authors include H. Balkan, Woon‐Seop Choi, Everett C. C. Yeh, K. N. Tu, K. N. Tu, Scott Barrett, T. T. Sheng, D. R. Frear, Ching‐Hsuan Tung and M. Li. Their work appears in journals such as Applied Physics Letters, IEEE Transactions on Electronics Packaging Manufacturing, Journal of Applied Physics, Journal of materials research/Pratt's guide to venture capital sources and Microelectronics Reliability.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.