David Ney
Impact in
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- Semiconductor materials and devices
- Radio Frequency Integrated Circuit Design
- Advancements in Semiconductor Devices and Circuit Design
- Integrated Circuits and Semiconductor Failure Analysis
- Electronic Packaging and Soldering Technologies
- 3D IC and TSV technologies
- Microwave Engineering and Waveguides
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- Copper Interconnects and Reliability
Papers in
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- Copper Interconnects and Reliability 31
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- Semiconductor materials and devices 38
- Electronic Packaging and Soldering Technologies 22
- Integrated Circuits and Semiconductor Failure Analysis 10
- Advancements in Semiconductor Devices and Circuit Design 7
- 3D IC and TSV technologies 6
- Radio Frequency Integrated Circuit Design 3
- Co-authors
- X. Federspiel (17 shared papers)Olivier Thomas (4 shared papers)Patrice Gergaud (4 shared papers)Laurent Doyen (7 shared papers)Y. Wouters (11 shared papers)F. Cacho (4 shared papers)Louise Lallement Arnaud (10 shared papers)E. Petitprez (6 shared papers)
- Journals
- Microelectronics Reliability (3 papers)Microelectronic Engineering (3 papers)IEEE Transactions on Device and Materials Reliability (2 papers)Journal of the National Medical Association (1 paper)IEEE Transactions on Applied Superconductivity (1 paper)
- Partner nations
- FranceSwitzerlandNetherlands
In The Last Decade
David Ney
47 papers receiving 472 citations
Peers
Comparison fields: 5 of 39
- Electrical and Electronic Engineering 459
- Electronic, Optical and Magnetic Materials 111
- Hardware and Architecture 25
- Atomic and Molecular Physics, and Optics 56
- Biomedical Engineering 46
Countries citing papers authored by David Ney
This map shows the geographic impact of David Ney's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by David Ney with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites David Ney more than expected).
Fields of papers citing papers by David Ney
This network shows the impact of papers produced by David Ney. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by David Ney. The network helps show where David Ney may publish in the future.
Co-authors
The 25 scholars most cited alongside David Ney, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.
All Works
Showing the 20 most-cited of 49 papers — load more, or switch the sort, to bring in the rest.
| # | Work | ||
|---|---|---|---|
| 1 | 2014 | 156 | |
| 2 | 2021 | 47 | |
| 3 | 2018 | 44 | |
| 4 | 2010 | 33 | |
| 5 | 2006 | 24 | |
| 6 | 2005 | 19 | |
| 7 | 2020 | 13 | |
| 8 | 2017 | 13 | |
| 9 | 2017 | 10 | |
| 10 | 2020 | 9 | |
| 11 | 2019 | 9 | |
| 12 | 2006 | 8 | |
| 13 | 2005 | 7 | |
| 14 | 2020 | 7 | |
| 15 | 2003 | 7 | |
| 16 | 2011 | 6 | |
| 17 | 2001 | 6 | |
| 18 | 2010 | 6 | |
| 19 | 2010 | 5 | |
| 20 | 2005 | 4 |
About David Ney
David Ney is a scholar working on Electronic, Optical and Magnetic Materials, Electrical and Electronic Engineering, Atomic and Molecular Physics, and Optics, Statistics, Probability and Uncertainty and Hardware and Architecture, having authored 49 papers that have together received 494 indexed citations. Recurring topics across this work include Semiconductor materials and devices (38 papers), Copper Interconnects and Reliability (31 papers), Electronic Packaging and Soldering Technologies (22 papers), Integrated Circuits and Semiconductor Failure Analysis (10 papers), Advancements in Semiconductor Devices and Circuit Design (7 papers), 3D IC and TSV technologies (6 papers), Semiconductor materials and interfaces (5 papers) and Radio Frequency Integrated Circuit Design (3 papers). The work is most often cited by research in Electrical and Electronic Engineering (459 citations), Electronic, Optical and Magnetic Materials (111 citations), Hardware and Architecture (25 citations), Atomic and Molecular Physics, and Optics (56 citations) and Biomedical Engineering (46 citations). David Ney has collaborated with scholars based in France, Switzerland and Netherlands. Frequent co-authors include X. Federspiel, Olivier Thomas, Patrice Gergaud, Laurent Doyen, Y. Wouters, F. Cacho, Louise Lallement Arnaud, E. Petitprez, A. Bravaix and Dominique Delille. Their work appears in journals such as Microelectronics Reliability, Microelectronic Engineering, IEEE Transactions on Device and Materials Reliability, Journal of the National Medical Association and IEEE Transactions on Applied Superconductivity.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.