R.D. Emery
Impact in
- Mechanics of Materials top 10%
- Metal and Thin Film Mechanics
-
- Microstructure and mechanical properties
Papers in
-
- Metal and Thin Film Mechanics 7
-
- Electronic Packaging and Soldering Technologies 5
- 3D IC and TSV technologies 5
- Semiconductor Lasers and Optical Devices 2
- Semiconductor materials and devices 2
- Electromagnetic Compatibility and Noise Suppression 2
- Co-authors
- G.L. Povirk (4 shared papers)Henning Braunisch (3 shared papers)Steven N. Towle (2 shared papers)M. Gherasimova (1 shared paper)J.D. Meindl (2 shared papers)Muhannad S. Bakir (2 shared papers)Paul A. Kohl (2 shared papers)Kyu‐Pyung Hwang (1 shared paper)
- Journals
- Biosystems (2 papers)Acta Materialia (2 papers)IEEE Transactions on Advanced Packaging (1 paper)The Fordham urban law journal/Fordham urban law journal (1 paper)MRS Proceedings (4 papers)
- Partner nations
- United StatesUnited KingdomGreece
In The Last Decade
R.D. Emery
15 papers receiving 359 citations
Peers
Comparison fields: 5 of 37
- Mechanics of Materials 146
- Materials Chemistry 145
- Electronic, Optical and Magnetic Materials 55
- Electrical and Electronic Engineering 163
- Biomedical Engineering 113
Countries citing papers authored by R.D. Emery
This map shows the geographic impact of R.D. Emery's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by R.D. Emery with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites R.D. Emery more than expected).
Fields of papers citing papers by R.D. Emery
This network shows the impact of papers produced by R.D. Emery. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by R.D. Emery. The network helps show where R.D. Emery may publish in the future.
Co-authors
The 19 scholars most cited alongside R.D. Emery, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.
All Works
| # | Work | ||
|---|---|---|---|
| 1 | 2003 | 122 | |
| 2 | 2003 | 91 | |
| 3 | 1997 | 39 | |
| 4 | 2003 | 36 | |
| 5 | 2001 | 31 | |
| 6 | 2005 | 17 | |
| 7 | 2004 | 8 | |
| 8 | 2003 | 7 | |
| 9 | 2001 | 5 | |
| 10 | 1997 | 5 | |
| 11 | 2003 | 3 | |
| 12 | 2004 | 3 | |
| 13 | Why Civil Rights Lawsuits Do NOt Deter Police Misconduct: The Conundrum of Indemnification And a Proposed Solution | 2000 | 2 |
| 14 | 2005 | 1 | |
| 15 | On the mechanical behavior of free-standing thin gold films | 2001 | 1 |
About R.D. Emery
R.D. Emery is a scholar working on Mechanics of Materials, Electrical and Electronic Engineering, Electronic, Optical and Magnetic Materials, Materials Chemistry and Political Science and International Relations, having authored 15 papers that have together received 371 indexed citations. Recurring topics across this work include Metal and Thin Film Mechanics (7 papers), Copper Interconnects and Reliability (7 papers), Electronic Packaging and Soldering Technologies (5 papers), 3D IC and TSV technologies (5 papers), Microstructure and mechanical properties (3 papers), Semiconductor Lasers and Optical Devices (2 papers), Semiconductor materials and devices (2 papers) and Electromagnetic Compatibility and Noise Suppression (2 papers). The work is most often cited by research in Mechanics of Materials (146 citations), Materials Chemistry (145 citations), Electronic, Optical and Magnetic Materials (55 citations), Electrical and Electronic Engineering (163 citations) and Biomedical Engineering (113 citations). R.D. Emery has collaborated with scholars based in United States, United Kingdom and Greece. Frequent co-authors include G.L. Povirk, Henning Braunisch, Steven N. Towle, M. Gherasimova, J.D. Meindl, Muhannad S. Bakir, Paul A. Kohl, Kyu‐Pyung Hwang, B. Dang and Benjamin A. Mazin. Their work appears in journals such as Biosystems, Acta Materialia, IEEE Transactions on Advanced Packaging, The Fordham urban law journal/Fordham urban law journal and MRS Proceedings.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.