Thomas Uhrmann
Impact in
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- 3D IC and TSV technologies
- Electronic Packaging and Soldering Technologies
- Semiconductor materials and devices
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- Additive Manufacturing and 3D Printing Technologies
Papers in
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- 3D IC and TSV technologies 35
- Electronic Packaging and Soldering Technologies 24
- Semiconductor materials and devices 10
- Advancements in Photolithography Techniques 9
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- Advanced Surface Polishing Techniques 7
- Nanofabrication and Lithography Techniques 6
- Co-authors
- Théodoros Dimopoulos (8 shared papers)H. Brückl (7 shared papers)Markus Wimplinger (23 shared papers)M. Rührig (2 shared papers)L. Bär (2 shared papers)Paul Lindner (11 shared papers)A. Kohn (4 shared papers)Eric Beyne (8 shared papers)
- Journals
- Applied Physics Letters (2 papers)Journal of Physics D Applied Physics (2 papers)Journal of Applied Physics (1 paper)IEEE Transactions on Magnetics (1 paper)Journal of Magnetism and Magnetic Materials (1 paper)
- Partner nations
- AustriaBelgiumUnited States
In The Last Decade
Thomas Uhrmann
48 papers receiving 398 citations
Peers
Comparison fields: 5 of 30
- Electrical and Electronic Engineering 323
- Automotive Engineering 48
- Atomic and Molecular Physics, and Optics 111
- Electronic, Optical and Magnetic Materials 59
- Ceramics and Composites 15
Countries citing papers authored by Thomas Uhrmann
This map shows the geographic impact of Thomas Uhrmann's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Thomas Uhrmann with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Thomas Uhrmann more than expected).
Fields of papers citing papers by Thomas Uhrmann
This network shows the impact of papers produced by Thomas Uhrmann. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Thomas Uhrmann. The network helps show where Thomas Uhrmann may publish in the future.
Co-authors
The 25 scholars most cited alongside Thomas Uhrmann, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.
All Works
Showing the 20 most-cited of 55 papers — load more, or switch the sort, to bring in the rest.
| # | Work | ||
|---|---|---|---|
| 1 | 2006 | 54 | |
| 2 | 2018 | 37 | |
| 3 | 2008 | 27 | |
| 4 | 2010 | 25 | |
| 5 | 2018 | 22 | |
| 6 | 2023 | 21 | |
| 7 | 2009 | 18 | |
| 8 | 2021 | 17 | |
| 9 | 2023 | 17 | |
| 10 | 2023 | 16 | |
| 11 | 2009 | 15 | |
| 12 | 2013 | 14 | |
| 13 | 2011 | 13 | |
| 14 | 2016 | 10 | |
| 15 | 2024 | 9 | |
| 16 | 2024 | 8 | |
| 17 | 2023 | 7 | |
| 18 | 2024 | 6 | |
| 19 | 2015 | 6 | |
| 20 | 2023 | 5 |
About Thomas Uhrmann
Thomas Uhrmann is a scholar working on Electrical and Electronic Engineering, Biomedical Engineering, Atomic and Molecular Physics, and Optics, Automotive Engineering and Industrial and Manufacturing Engineering, having authored 55 papers that have together received 415 indexed citations. Recurring topics across this work include 3D IC and TSV technologies (35 papers), Electronic Packaging and Soldering Technologies (24 papers), Semiconductor materials and devices (10 papers), Advancements in Photolithography Techniques (9 papers), Advanced Surface Polishing Techniques (7 papers), Additive Manufacturing and 3D Printing Technologies (7 papers), Nanofabrication and Lithography Techniques (6 papers) and Laser Material Processing Techniques (5 papers). The work is most often cited by research in Electrical and Electronic Engineering (323 citations), Automotive Engineering (48 citations), Atomic and Molecular Physics, and Optics (111 citations), Electronic, Optical and Magnetic Materials (59 citations) and Ceramics and Composites (15 citations). Thomas Uhrmann has collaborated with scholars based in Austria, Belgium and United States. Frequent co-authors include Théodoros Dimopoulos, H. Brückl, Markus Wimplinger, M. Rührig, L. Bär, Paul Lindner, A. Kohn, Eric Beyne, Sascha Weyers and Uwe Paschen. Their work appears in journals such as Applied Physics Letters, Journal of Physics D Applied Physics, Journal of Applied Physics, IEEE Transactions on Magnetics and Journal of Magnetism and Magnetic Materials.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.