Xavier Baraton
Impact in
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- Electronic Packaging and Soldering Technologies
- 3D IC and TSV technologies
- Integrated Circuits and Semiconductor Failure Analysis
- Electromagnetic Compatibility and Noise Suppression
- Mechanics of Materials top 10%
- Mechanical Behavior of Composites
- Material Properties and Processing
Papers in
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- Electronic Packaging and Soldering Technologies 23
- 3D IC and TSV technologies 21
- Electromagnetic Compatibility and Noise Suppression 6
- Integrated Circuits and Semiconductor Failure Analysis 3
- Silicon Carbide Semiconductor Technologies 1
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- VLSI and Analog Circuit Testing 3
- Co-authors
- Jing-en Luan (13 shared papers)Tong Yan Tee (3 shared papers)D. Yap (4 shared papers)Z.W. Zhong (2 shared papers)Hun Shen Ng (2 shared papers)Seung Wook Yoon (7 shared papers)Pandi Chelvam Marimuthu (7 shared papers)Yonggang Jin (7 shared papers)
- Journals
- Microelectronics Reliability (3 papers)Additional Conferences (Device Packaging HiTEC HiTEN & CICMT) (1 paper)European Microelectronics and Packaging Conference (1 paper)National University of Singapore (1 paper)
- Partner nations
- SingaporeSwitzerlandGermany
In The Last Decade
Xavier Baraton
22 papers receiving 369 citations
Peers
Comparison fields: 5 of 27
- Electrical and Electronic Engineering 399
- Mechanics of Materials 103
- Mechanical Engineering 102
- Hardware and Architecture 14
- Electronic, Optical and Magnetic Materials 30
Countries citing papers authored by Xavier Baraton
This map shows the geographic impact of Xavier Baraton's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Xavier Baraton with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Xavier Baraton more than expected).
Fields of papers citing papers by Xavier Baraton
This network shows the impact of papers produced by Xavier Baraton. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Xavier Baraton. The network helps show where Xavier Baraton may publish in the future.
Co-authors
The 19 scholars most cited alongside Xavier Baraton, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.
All Works
Showing the 20 most-cited of 24 papers — load more, or switch the sort, to bring in the rest.
| # | Work | ||
|---|---|---|---|
| 1 | 2003 | 72 | |
| 2 | 2010 | 59 | |
| 3 | 2003 | 47 | |
| 4 | 2005 | 35 | |
| 5 | 2011 | 27 | |
| 6 | 2008 | 27 | |
| 7 | 2009 | 22 | |
| 8 | 2010 | 18 | |
| 9 | 2003 | 13 | |
| 10 | 2008 | 12 | |
| 11 | 2009 | 12 | |
| 12 | 2012 | 12 | |
| 13 | 2002 | 11 | |
| 14 | Thermoelastic properties of printed circuit boards: Effect of copper trace | 2009 | 11 |
| 15 | 2008 | 10 | |
| 16 | 2008 | 9 | |
| 17 | 2009 | 8 | |
| 18 | 2008 | 5 | |
| 19 | 2009 | 4 | |
| 20 | 2012 | 4 |
About Xavier Baraton
Xavier Baraton is a scholar working on Electrical and Electronic Engineering, Hardware and Architecture, Mechanics of Materials, Mechanical Engineering and Industrial and Manufacturing Engineering, having authored 24 papers that have together received 426 indexed citations. Recurring topics across this work include Electronic Packaging and Soldering Technologies (23 papers), 3D IC and TSV technologies (21 papers), Electromagnetic Compatibility and Noise Suppression (6 papers), VLSI and Analog Circuit Testing (3 papers), Mechanical Behavior of Composites (3 papers), Integrated Circuits and Semiconductor Failure Analysis (3 papers), Advanced Welding Techniques Analysis (2 papers) and Silicon Carbide Semiconductor Technologies (1 paper). The work is most often cited by research in Electrical and Electronic Engineering (399 citations), Mechanics of Materials (103 citations), Mechanical Engineering (102 citations), Hardware and Architecture (14 citations) and Electronic, Optical and Magnetic Materials (30 citations). Xavier Baraton has collaborated with scholars based in Singapore, Switzerland and Germany. Frequent co-authors include Jing-en Luan, Tong Yan Tee, D. Yap, Z.W. Zhong, Hun Shen Ng, Seung Wook Yoon, Pandi Chelvam Marimuthu, Yonggang Jin, Guojun Hu and Andreas Bahr. Their work appears in journals such as Microelectronics Reliability, Additional Conferences (Device Packaging HiTEC HiTEN & CICMT), European Microelectronics and Packaging Conference and National University of Singapore.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.