Jaechoon Kim
Impact in
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- 3D IC and TSV technologies
- Electronic Packaging and Soldering Technologies
- Semiconductor materials and devices
- Electromagnetic Compatibility and Noise Suppression
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- Heat Transfer and Optimization
Papers in
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- Thermal Radiation and Cooling Technologies 5
- Engineering Applied Research 3
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- 3D IC and TSV technologies 8
- Electronic Packaging and Soldering Technologies 8
- Co-authors
- Dan Kyung Suk Oh (6 shared papers)Jaeho Lee (5 shared papers)Youngsuk Nam (7 shared papers)Seokkan Ki (5 shared papers)Donghyun Seo (2 shared papers)Kil‐Soo Kim (3 shared papers)Seungtae Oh (2 shared papers)Seunggeol Ryu (3 shared papers)
- Journals
- IEEE Access (2 papers)Journal of Electronic Packaging (2 papers)IEEE Transactions on Components Packaging and Manufacturing Technology (2 papers)Sensors and Actuators A Physical (1 paper)IEEE Transactions on Electron Devices (1 paper)
- Partner nations
- South KoreaUnited States
In The Last Decade
Jaechoon Kim
26 papers receiving 336 citations
Peers
Comparison fields: 5 of 41
- Electrical and Electronic Engineering 188
- Mechanical Engineering 117
- Civil and Structural Engineering 59
- Materials Chemistry 105
- Automotive Engineering 25
Countries citing papers authored by Jaechoon Kim
This map shows the geographic impact of Jaechoon Kim's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Jaechoon Kim with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Jaechoon Kim more than expected).
Fields of papers citing papers by Jaechoon Kim
This network shows the impact of papers produced by Jaechoon Kim. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Jaechoon Kim. The network helps show where Jaechoon Kim may publish in the future.
Co-authors
The 25 scholars most cited alongside Jaechoon Kim, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.
All Works
Showing the 20 most-cited of 28 papers — load more, or switch the sort, to bring in the rest.
| # | Work | ||
|---|---|---|---|
| 1 | 2021 | 67 | |
| 2 | 2018 | 52 | |
| 3 | 2020 | 52 | |
| 4 | 2018 | 26 | |
| 5 | 2020 | 25 | |
| 6 | 2023 | 21 | |
| 7 | 2018 | 18 | |
| 8 | 2022 | 14 | |
| 9 | 2024 | 13 | |
| 10 | 2021 | 12 | |
| 11 | 2019 | 10 | |
| 12 | 2024 | 10 | |
| 13 | 2022 | 9 | |
| 14 | 2009 | 7 | |
| 15 | 2022 | 6 | |
| 16 | 2024 | 5 | |
| 17 | 2022 | 5 | |
| 18 | 2025 | 4 | |
| 19 | 2021 | 3 | |
| 20 | 2022 | 3 |
About Jaechoon Kim
Jaechoon Kim is a scholar working on Civil and Structural Engineering, Electrical and Electronic Engineering, Mechanical Engineering, Materials Chemistry and Computational Mechanics, having authored 28 papers that have together received 368 indexed citations. Recurring topics across this work include 3D IC and TSV technologies (8 papers), Electronic Packaging and Soldering Technologies (8 papers), Thermal properties of materials (7 papers), Heat Transfer and Optimization (6 papers), Thermal Radiation and Cooling Technologies (5 papers), Engineering Applied Research (3 papers), Advanced Thermoelectric Materials and Devices (3 papers) and Tribology and Lubrication Engineering (2 papers). The work is most often cited by research in Electrical and Electronic Engineering (188 citations), Mechanical Engineering (117 citations), Civil and Structural Engineering (59 citations), Materials Chemistry (105 citations) and Automotive Engineering (25 citations). Jaechoon Kim has collaborated with scholars based in South Korea and United States. Frequent co-authors include Dan Kyung Suk Oh, Jaeho Lee, Youngsuk Nam, Seokkan Ki, Donghyun Seo, Kil‐Soo Kim, Seungtae Oh, Seunggeol Ryu, Jaehwan Shim and Eunjoo Koh. Their work appears in journals such as IEEE Access, Journal of Electronic Packaging, IEEE Transactions on Components Packaging and Manufacturing Technology, Sensors and Actuators A Physical and IEEE Transactions on Electron Devices.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.