Eric Pek
Impact in
-
- Electronic Packaging and Soldering Technologies
- 3D IC and TSV technologies
- Electrostatic Discharge in Electronics
- Integrated Circuits and Semiconductor Failure Analysis
- Electromagnetic Compatibility and Noise Suppression
- Mechanics of Materials top 5%
- Material Properties and Processing
Papers in
-
- 3D IC and TSV technologies 9
- Electronic Packaging and Soldering Technologies 9
- Electrostatic Discharge in Electronics 7
-
- Material Properties and Processing 2
- Co-authors
- Chwee Teck Lim (9 shared papers)Tong Yan Tee (9 shared papers)Z.W. Zhong (7 shared papers)Jing-en Luan (6 shared papers)Hun Shen Ng (2 shared papers)Jiang Zhou (1 shared paper)V.B.C. Tan (1 shared paper)
- Journals
- Microelectronics Reliability (2 papers)IEEE Transactions on Components and Packaging Technologies (1 paper)National University of Singapore (5 papers)
- Partner nations
- SingaporeUnited StatesSwitzerland
In The Last Decade
Eric Pek
9 papers receiving 614 citations
Peers
Comparison fields: 5 of 26
- Electrical and Electronic Engineering 624
- Mechanics of Materials 232
- Mechanical Engineering 99
- Hardware and Architecture 16
- Civil and Structural Engineering 39
Countries citing papers authored by Eric Pek
This map shows the geographic impact of Eric Pek's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Eric Pek with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Eric Pek more than expected).
Fields of papers citing papers by Eric Pek
This network shows the impact of papers produced by Eric Pek. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Eric Pek. The network helps show where Eric Pek may publish in the future.
Co-authors
The 7 scholars most cited alongside Eric Pek, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.
All Works
| # | Work | ||
|---|---|---|---|
| 1 | 2004 | 163 | |
| 2 | 2004 | 137 | |
| 3 | 2004 | 101 | |
| 4 | 2004 | 82 | |
| 5 | 2004 | 77 | |
| 6 | 2006 | 63 | |
| 7 | 2007 | 34 | |
| 8 | 2006 | 5 | |
| 9 | 2006 | 4 |
About Eric Pek
Eric Pek is a scholar working on Electrical and Electronic Engineering, Mechanics of Materials, Insect Science, Renewable Energy, Sustainability and the Environment and Obstetrics and Gynecology, having authored 9 papers that have together received 666 indexed citations. Recurring topics across this work include 3D IC and TSV technologies (9 papers), Electronic Packaging and Soldering Technologies (9 papers), Electrostatic Discharge in Electronics (7 papers) and Material Properties and Processing (2 papers). The work is most often cited by research in Electrical and Electronic Engineering (624 citations), Mechanics of Materials (232 citations), Mechanical Engineering (99 citations), Hardware and Architecture (16 citations) and Civil and Structural Engineering (39 citations). Eric Pek has collaborated with scholars based in Singapore, United States and Switzerland. Frequent co-authors include Chwee Teck Lim, Tong Yan Tee, Z.W. Zhong, Jing-en Luan, Hun Shen Ng, Jiang Zhou and V.B.C. Tan. Their work appears in journals such as Microelectronics Reliability, IEEE Transactions on Components and Packaging Technologies and National University of Singapore.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.