Nicholas Kao
Impact in
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- Electronic Packaging and Soldering Technologies
- 3D IC and TSV technologies
- Electromagnetic Compatibility and Noise Suppression
- Integrated Circuits and Semiconductor Failure Analysis
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- Manufacturing Process and Optimization
Papers in
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- 3D IC and TSV technologies 39
- Electronic Packaging and Soldering Technologies 38
- Silicon and Solar Cell Technologies 6
- Electromagnetic Compatibility and Noise Suppression 5
- Silicon Carbide Semiconductor Technologies 3
- VLSI and FPGA Design Techniques 3
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- Advanced Materials and Mechanics 3
- Co-authors
- Don Son Jiang (16 shared papers)Yu-Po Wang (11 shared papers)Yiwei Liu (1 shared paper)Hung‐wen Liu (1 shared paper)Eason Chen (3 shared papers)Yusheng Wang (1 shared paper)Yi‐Cheng Chu (1 shared paper)George Pan (4 shared papers)
- Journals
- Microelectronics Reliability (2 papers)Electronic Materials Letters (1 paper)IMAPSource Proceedings (2 papers)Rare & Special e-Zone (The Hong Kong University of Science and Technology) (1 paper)2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) (1 paper)
- Partner nations
- TaiwanUnited States
In The Last Decade
Nicholas Kao
35 papers receiving 266 citations
Peers
Comparison fields: 5 of 24
- Electrical and Electronic Engineering 260
- Industrial and Manufacturing Engineering 19
- Automotive Engineering 22
- Mechanical Engineering 66
- Electronic, Optical and Magnetic Materials 30
Countries citing papers authored by Nicholas Kao
This map shows the geographic impact of Nicholas Kao's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Nicholas Kao with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Nicholas Kao more than expected).
Fields of papers citing papers by Nicholas Kao
This network shows the impact of papers produced by Nicholas Kao. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Nicholas Kao. The network helps show where Nicholas Kao may publish in the future.
Co-authors
The 22 scholars most cited alongside Nicholas Kao, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.
All Works
Showing the 20 most-cited of 41 papers — load more, or switch the sort, to bring in the rest.
| # | Work | ||
|---|---|---|---|
| 1 | 2014 | 47 | |
| 2 | 2005 | 43 | |
| 3 | 2007 | 23 | |
| 4 | 2006 | 16 | |
| 5 | 2013 | 14 | |
| 6 | 2021 | 12 | |
| 7 | 2017 | 12 | |
| 8 | 2005 | 10 | |
| 9 | 2006 | 10 | |
| 10 | 2020 | 10 | |
| 11 | 2012 | 9 | |
| 12 | 2017 | 9 | |
| 13 | 2023 | 8 | |
| 14 | 2005 | 7 | |
| 15 | 2014 | 5 | |
| 16 | 2005 | 5 | |
| 17 | 2021 | 5 | |
| 18 | 2012 | 4 | |
| 19 | 2010 | 4 | |
| 20 | 2014 | 3 |
About Nicholas Kao
Nicholas Kao is a scholar working on Electrical and Electronic Engineering, Mechanical Engineering, Automotive Engineering, Mechanics of Materials and Industrial and Manufacturing Engineering, having authored 41 papers that have together received 284 indexed citations. Recurring topics across this work include 3D IC and TSV technologies (39 papers), Electronic Packaging and Soldering Technologies (38 papers), Silicon and Solar Cell Technologies (6 papers), Electromagnetic Compatibility and Noise Suppression (5 papers), Silicon Carbide Semiconductor Technologies (3 papers), VLSI and FPGA Design Techniques (3 papers), Additive Manufacturing and 3D Printing Technologies (3 papers) and Advanced Materials and Mechanics (3 papers). The work is most often cited by research in Electrical and Electronic Engineering (260 citations), Industrial and Manufacturing Engineering (19 citations), Automotive Engineering (22 citations), Mechanical Engineering (66 citations) and Electronic, Optical and Magnetic Materials (30 citations). Nicholas Kao has collaborated with scholars based in Taiwan and United States. Frequent co-authors include Don Son Jiang, Yu-Po Wang, Yiwei Liu, Hung‐wen Liu, Eason Chen, Yusheng Wang, Yi‐Cheng Chu, George Pan, Chih Chen and Enboa Wu. Their work appears in journals such as Microelectronics Reliability, Electronic Materials Letters, IMAPSource Proceedings, Rare & Special e-Zone (The Hong Kong University of Science and Technology) and 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC).
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.