Timwah Luk
Impact in
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- Electronic Packaging and Soldering Technologies
- 3D IC and TSV technologies
- Electromagnetic Compatibility and Noise Suppression
- Silicon Carbide Semiconductor Technologies
- Integrated Circuits and Semiconductor Failure Analysis
- Electrostatic Discharge in Electronics
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- Copper Interconnects and Reliability
Papers in
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- Electronic Packaging and Soldering Technologies 32
- 3D IC and TSV technologies 17
- Electromagnetic Compatibility and Noise Suppression 7
- Silicon Carbide Semiconductor Technologies 5
- Semiconductor materials and devices 5
- Integrated Circuits and Semiconductor Failure Analysis 4
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- Heat Transfer and Optimization 4
- Co-authors
- Scott Irving (36 shared papers)Yong Liu (10 shared papers)Lihua Liang (5 shared papers)Yong Liu (2 shared papers)Yong Liu (4 shared papers)Feng Zhang (1 shared paper)Dan Kinzer (1 shared paper)Yuanzhong Zhou (1 shared paper)
- Journals
- IEEE Transactions on Electronics Packaging Manufacturing (3 papers)Solid-State Electronics (1 paper)Microelectronics Reliability (1 paper)TechConnect Briefs (1 paper)
- Partner nations
- United StatesChina
In The Last Decade
Timwah Luk
40 papers receiving 376 citations
Peers
Comparison fields: 5 of 34
- Electrical and Electronic Engineering 352
- Electronic, Optical and Magnetic Materials 72
- Industrial and Manufacturing Engineering 30
- Mechanics of Materials 74
- Mechanical Engineering 100
Countries citing papers authored by Timwah Luk
This map shows the geographic impact of Timwah Luk's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Timwah Luk with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Timwah Luk more than expected).
Fields of papers citing papers by Timwah Luk
This network shows the impact of papers produced by Timwah Luk. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Timwah Luk. The network helps show where Timwah Luk may publish in the future.
Co-authors
The 25 scholars most cited alongside Timwah Luk, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.
All Works
Showing the 20 most-cited of 43 papers — load more, or switch the sort, to bring in the rest.
| # | Work | ||
|---|---|---|---|
| 1 | 2008 | 58 | |
| 2 | 2008 | 49 | |
| 3 | 2007 | 45 | |
| 4 | 2008 | 32 | |
| 5 | 2005 | 26 | |
| 6 | 2007 | 18 | |
| 7 | 2004 | 18 | |
| 8 | 2005 | 17 | |
| 9 | 2006 | 15 | |
| 10 | 2009 | 10 | |
| 11 | 2006 | 9 | |
| 12 | 2008 | 8 | |
| 13 | 2007 | 8 | |
| 14 | 2005 | 6 | |
| 15 | 2006 | 6 | |
| 16 | 2005 | 6 | |
| 17 | 2007 | 6 | |
| 18 | 2006 | 6 | |
| 19 | 2007 | 5 | |
| 20 | 2007 | 5 |
About Timwah Luk
Timwah Luk is a scholar working on Electrical and Electronic Engineering, Mechanical Engineering, Electronic, Optical and Magnetic Materials, Mechanics of Materials and Biomedical Engineering, having authored 43 papers that have together received 400 indexed citations. Recurring topics across this work include Electronic Packaging and Soldering Technologies (32 papers), 3D IC and TSV technologies (17 papers), Copper Interconnects and Reliability (9 papers), Electromagnetic Compatibility and Noise Suppression (7 papers), Silicon Carbide Semiconductor Technologies (5 papers), Semiconductor materials and devices (5 papers), Heat Transfer and Optimization (4 papers) and Integrated Circuits and Semiconductor Failure Analysis (4 papers). The work is most often cited by research in Electrical and Electronic Engineering (352 citations), Electronic, Optical and Magnetic Materials (72 citations), Industrial and Manufacturing Engineering (30 citations), Mechanics of Materials (74 citations) and Mechanical Engineering (100 citations). Timwah Luk has collaborated with scholars based in United States and China. Frequent co-authors include Scott Irving, Yong Liu, Lihua Liang, Yong Liu, Yong Liu, Feng Zhang, Dan Kinzer, Yong Liu, Yuanzhong Zhou and Yong Liu. Their work appears in journals such as IEEE Transactions on Electronics Packaging Manufacturing, Solid-State Electronics, Microelectronics Reliability and TechConnect Briefs.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.