Yaojian Lin

12 papers and 477 indexed citations i.

Yaojian Lin has authored 12 papers that have received a total of 477 indexed citations. This includes 8 papers in Electrical and Electronic Engineering, 2 papers in Genetics and 2 papers in Industrial and Manufacturing Engineering. The topics of these papers are 3D IC and TSV technologies (5 papers), Electronic Packaging and Soldering Technologies (4 papers) and Microwave Engineering and Waveguides (3 papers). Yaojian Lin is often cited by papers focused on 3D IC and TSV technologies (5 papers), Electronic Packaging and Soldering Technologies (4 papers) and Microwave Engineering and Waveguides (3 papers) and collaborates with scholars based in United States. Yaojian Lin's co-authors include R.C. Frye, Seung Wook Yoon, Pandi C. Marimuthu, Kai Liu and Yonggang Jin and has published in prestigious journals such as Proceedings of the National Academy of Sciences, Molecular and Cellular Biology and Journal of Microelectronics and Electronic Packaging.