Karsten Meier
Impact in
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- Electronic Packaging and Soldering Technologies
- 3D IC and TSV technologies
- Integrated Circuits and Semiconductor Failure Analysis
- Electromagnetic Compatibility and Noise Suppression
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- Advanced Welding Techniques Analysis
- Aluminum Alloys Composites Properties
Papers in
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- Electronic Packaging and Soldering Technologies 83
- 3D IC and TSV technologies 48
- Integrated Circuits and Semiconductor Failure Analysis 12
- Electromagnetic Compatibility and Noise Suppression 10
- Electrostatic Discharge in Electronics 8
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- Advanced Welding Techniques Analysis 10
- Aluminum Alloys Composites Properties 7
- Co-authors
- M. Roellig (36 shared papers)Karlheinz Bock (49 shared papers)Steffen Wiese (14 shared papers)Klaus-Juergen Wolter (8 shared papers)Andreas Schießl (5 shared papers)K.-J. Wolter (10 shared papers)Abhijit Dasgupta (8 shared papers)David Leslie (6 shared papers)
- Journals
- Microelectronics Reliability (5 papers)IEEE Transactions on Components Packaging and Manufacturing Technology (2 papers)IEEE Transactions on Device and Materials Reliability (1 paper)IEEE Transactions on Electron Devices (1 paper)Journal of Vacuum Science & Technology B Nanotechnology and Microelectronics Materials Processing Measurement and Phenomena (1 paper)
- Partner nations
- GermanyUnited StatesItaly
In The Last Decade
Karsten Meier
83 papers receiving 325 citations
Peers
Comparison fields: 5 of 31
- Electrical and Electronic Engineering 300
- Mechanical Engineering 133
- Mechanics of Materials 84
- General Materials Science 7
- Ceramics and Composites 10
Countries citing papers authored by Karsten Meier
This map shows the geographic impact of Karsten Meier's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Karsten Meier with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Karsten Meier more than expected).
Fields of papers citing papers by Karsten Meier
This network shows the impact of papers produced by Karsten Meier. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Karsten Meier. The network helps show where Karsten Meier may publish in the future.
Co-authors
The 25 scholars most cited alongside Karsten Meier, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.
All Works
Showing the 20 most-cited of 96 papers — load more, or switch the sort, to bring in the rest.
| # | Work | ||
|---|---|---|---|
| 1 | 2014 | 17 | |
| 2 | 2006 | 15 | |
| 3 | 2011 | 15 | |
| 4 | 2007 | 13 | |
| 5 | 2010 | 11 | |
| 6 | 2019 | 9 | |
| 7 | 2019 | 9 | |
| 8 | 2018 | 9 | |
| 9 | 2014 | 9 | |
| 10 | 2020 | 9 | |
| 11 | 2008 | 8 | |
| 12 | 2018 | 7 | |
| 13 | 2012 | 7 | |
| 14 | 2018 | 7 | |
| 15 | 2009 | 7 | |
| 16 | 2013 | 7 | |
| 17 | 2022 | 7 | |
| 18 | 2011 | 6 | |
| 19 | 2007 | 5 | |
| 20 | 2019 | 5 |
About Karsten Meier
Karsten Meier is a scholar working on Electrical and Electronic Engineering, Mechanical Engineering, Mechanics of Materials, Biomedical Engineering and Aerospace Engineering, having authored 96 papers that have together received 335 indexed citations. Recurring topics across this work include Electronic Packaging and Soldering Technologies (83 papers), 3D IC and TSV technologies (48 papers), Integrated Circuits and Semiconductor Failure Analysis (12 papers), Advanced Welding Techniques Analysis (10 papers), Electromagnetic Compatibility and Noise Suppression (10 papers), Electrostatic Discharge in Electronics (8 papers), Metallurgy and Material Forming (7 papers) and Aluminum Alloys Composites Properties (7 papers). The work is most often cited by research in Electrical and Electronic Engineering (300 citations), Mechanical Engineering (133 citations), Mechanics of Materials (84 citations), General Materials Science (7 citations) and Ceramics and Composites (10 citations). Karsten Meier has collaborated with scholars based in Germany, United States and Italy. Frequent co-authors include M. Roellig, Karlheinz Bock, Steffen Wiese, Klaus-Juergen Wolter, Andreas Schießl, K.-J. Wolter, Abhijit Dasgupta, David Leslie, Frank Alexander Kraemer and Klaus‐Jürgen Wolter. Their work appears in journals such as Microelectronics Reliability, IEEE Transactions on Components Packaging and Manufacturing Technology, IEEE Transactions on Device and Materials Reliability, IEEE Transactions on Electron Devices and Journal of Vacuum Science & Technology B Nanotechnology and Microelectronics Materials Processing Measurement and Phenomena.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.