Karsten Meier
Impact in
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- Electronic Packaging and Soldering Technologies
- 3D IC and TSV technologies
- Integrated Circuits and Semiconductor Failure Analysis
- Advancements in Semiconductor Devices and Circuit Design
- Microwave Engineering and Waveguides
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- Metal and Thin Film Mechanics
Papers in
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- Electronic Packaging and Soldering Technologies 87
- 3D IC and TSV technologies 11
- Integrated Circuits and Semiconductor Failure Analysis 5
- Advancements in Semiconductor Devices and Circuit Design 5
- Electrical and Thermal Properties of Materials 2
- Nanomaterials and Printing Technologies 2
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- Copper Interconnects and Reliability 4
- Co-authors
- M. Roellig (38 shared papers)Karlheinz Bock (54 shared papers)Klaus‐Jürgen Wolter (12 shared papers)Steffen Wiese (14 shared papers)K.-J. Wolter (12 shared papers)Andreas Schießl (5 shared papers)Abhijit Dasgupta (8 shared papers)Sven Rzepka (3 shared papers)
- Journals
- Microelectronics Reliability (5 papers)IEEE Transactions on Components Packaging and Manufacturing Technology (2 papers)IEEE Transactions on Electron Devices (1 paper)Journal of Vacuum Science & Technology B Nanotechnology and Microelectronics Materials Processing Measurement and Phenomena (1 paper)IEEE Transactions on Device and Materials Reliability (1 paper)
- Partner nations
- GermanyUnited StatesItaly
In The Last Decade
Karsten Meier
89 papers receiving 342 citations
Peers
Comparison fields: 5 of 19
- Electrical and Electronic Engineering 329
- Mechanics of Materials 15
- Safety, Risk, Reliability and Quality 6
- Automotive Engineering 5
- Hardware and Architecture 4
Countries citing papers authored by Karsten Meier
This map shows the geographic impact of Karsten Meier's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Karsten Meier with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Karsten Meier more than expected).
Fields of papers citing papers by Karsten Meier
This network shows the impact of papers produced by Karsten Meier. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Karsten Meier. The network helps show where Karsten Meier may publish in the future.
Co-authors
The 25 scholars most cited alongside Karsten Meier, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.
All Works
Showing the 20 most-cited of 101 papers — load more, or switch the sort, to bring in the rest.
| # | Work | ||
|---|---|---|---|
| 1 | 2014 | 17 | |
| 2 | 2006 | 15 | |
| 3 | 2011 | 15 | |
| 4 | 2007 | 13 | |
| 5 | 2010 | 11 | |
| 6 | 2018 | 10 | |
| 7 | 2019 | 10 | |
| 8 | 2012 | 9 | |
| 9 | 2014 | 9 | |
| 10 | 2019 | 9 | |
| 11 | 2020 | 9 | |
| 12 | 2008 | 8 | |
| 13 | 2009 | 7 | |
| 14 | 2013 | 7 | |
| 15 | 2018 | 7 | |
| 16 | 2018 | 7 | |
| 17 | 2021 | 7 | |
| 18 | 2022 | 7 | |
| 19 | 2011 | 6 | |
| 20 | 2007 | 5 |
About Karsten Meier
Karsten Meier is a scholar working on Electrical and Electronic Engineering, Electronic, Optical and Magnetic Materials, Mechanics of Materials, Hardware and Architecture and Industrial and Manufacturing Engineering, having authored 101 papers that have together received 356 indexed citations. Recurring topics across this work include Electronic Packaging and Soldering Technologies (87 papers), 3D IC and TSV technologies (11 papers), Integrated Circuits and Semiconductor Failure Analysis (5 papers), Advancements in Semiconductor Devices and Circuit Design (5 papers), Copper Interconnects and Reliability (4 papers), Metal and Thin Film Mechanics (3 papers), Electrical and Thermal Properties of Materials (2 papers) and Nanomaterials and Printing Technologies (2 papers). The work is most often cited by research in Electrical and Electronic Engineering (329 citations), Mechanics of Materials (15 citations), Safety, Risk, Reliability and Quality (6 citations), Automotive Engineering (5 citations) and Hardware and Architecture (4 citations). Karsten Meier has collaborated with scholars based in Germany, United States and Italy. Frequent co-authors include M. Roellig, Karlheinz Bock, Klaus‐Jürgen Wolter, Steffen Wiese, K.-J. Wolter, Andreas Schießl, Abhijit Dasgupta, Sven Rzepka, Ehrenfried Zschech and André Clausner. Their work appears in journals such as Microelectronics Reliability, IEEE Transactions on Components Packaging and Manufacturing Technology, IEEE Transactions on Electron Devices, Journal of Vacuum Science & Technology B Nanotechnology and Microelectronics Materials Processing Measurement and Phenomena and IEEE Transactions on Device and Materials Reliability.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.