Severine Cheramy
Impact in
- Hardware and Architecture top 5%
-
- 3D IC and TSV technologies
- Electronic Packaging and Soldering Technologies
- Semiconductor materials and devices
- Integrated Circuits and Semiconductor Failure Analysis
- Advanced Memory and Neural Computing
Papers in
-
- 3D IC and TSV technologies 66
- Electronic Packaging and Soldering Technologies 46
- Semiconductor materials and devices 17
-
- Additive Manufacturing and 3D Printing Technologies 17
- Co-authors
- A. Jouve (21 shared papers)A. Farcy (21 shared papers)Nicolas Sillon (15 shared papers)Pascal Vivet (13 shared papers)Frank Fournel (9 shared papers)David D. Henry (6 shared papers)Jean Charbonnier (9 shared papers)P. Coudrain (18 shared papers)
- Journals
- IEEE Transactions on Components Packaging and Manufacturing Technology (3 papers)IEEE Transactions on Nuclear Science (2 papers)IEEE Journal of Solid-State Circuits (2 papers)IEEE Electron Device Letters (1 paper)MRS Communications (1 paper)
- Partner nations
- FranceSwitzerlandUnited States
In The Last Decade
Severine Cheramy
80 papers receiving 994 citations
Peers
Comparison fields: 5 of 47
- Hardware and Architecture 125
- Electrical and Electronic Engineering 954
- Automotive Engineering 160
- Electronic, Optical and Magnetic Materials 97
- Computer Networks and Communications 100
Countries citing papers authored by Severine Cheramy
This map shows the geographic impact of Severine Cheramy's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Severine Cheramy with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Severine Cheramy more than expected).
Fields of papers citing papers by Severine Cheramy
This network shows the impact of papers produced by Severine Cheramy. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Severine Cheramy. The network helps show where Severine Cheramy may publish in the future.
Co-authors
The 25 scholars most cited alongside Severine Cheramy, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.
All Works
Showing the 20 most-cited of 82 papers — load more, or switch the sort, to bring in the rest.
| # | Work | ||
|---|---|---|---|
| 1 | 2020 | 99 | |
| 2 | 2016 | 84 | |
| 3 | 2018 | 75 | |
| 4 | 2019 | 56 | |
| 5 | 2009 | 54 | |
| 6 | 2020 | 51 | |
| 7 | A 0.9 pJ/bit, 12.8 GByte/s WideIO memory interface in a 3D-IC NoC-based MPSoC | 2013 | 35 |
| 8 | 2017 | 32 | |
| 9 | 2020 | 29 | |
| 10 | 2010 | 26 | |
| 11 | 2016 | 26 | |
| 12 | 2019 | 22 | |
| 13 | 2016 | 20 | |
| 14 | 2013 | 19 | |
| 15 | 2021 | 17 | |
| 16 | 2012 | 17 | |
| 17 | 2009 | 16 | |
| 18 | 2015 | 16 | |
| 19 | 2009 | 15 | |
| 20 | 2015 | 15 |
About Severine Cheramy
Severine Cheramy is a scholar working on Electrical and Electronic Engineering, Automotive Engineering, Electronic, Optical and Magnetic Materials, Biomedical Engineering and Hardware and Architecture, having authored 82 papers that have together received 1.0k indexed citations. Recurring topics across this work include 3D IC and TSV technologies (66 papers), Electronic Packaging and Soldering Technologies (46 papers), Additive Manufacturing and 3D Printing Technologies (17 papers), Semiconductor materials and devices (17 papers), Copper Interconnects and Reliability (10 papers), Heat Transfer and Optimization (7 papers), Advanced Surface Polishing Techniques (7 papers) and Nanofabrication and Lithography Techniques (7 papers). The work is most often cited by research in Hardware and Architecture (125 citations), Electrical and Electronic Engineering (954 citations), Automotive Engineering (160 citations), Electronic, Optical and Magnetic Materials (97 citations) and Computer Networks and Communications (100 citations). Severine Cheramy has collaborated with scholars based in France, Switzerland and United States. Frequent co-authors include A. Jouve, A. Farcy, Nicolas Sillon, Pascal Vivet, Frank Fournel, David D. Henry, Jean Charbonnier, P. Coudrain, N. Bresson and Didier Lattard. Their work appears in journals such as IEEE Transactions on Components Packaging and Manufacturing Technology, IEEE Transactions on Nuclear Science, IEEE Journal of Solid-State Circuits, IEEE Electron Device Letters and MRS Communications.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.