Ke Zeng
Impact in
- General Materials Science top 0.2%
-
- Ga2O3 and related materials
Papers in
-
- Electronic Packaging and Soldering Technologies 15
- Semiconductor materials and devices 8
-
- Ga2O3 and related materials 19
- Co-authors
- K. N. Tu (2 shared papers)K. N. Tu (4 shared papers)Uttam Singisetti (16 shared papers)Marko Hämäläinen (5 shared papers)J.K. Kivilahti (10 shared papers)Abhishek Vaidya (4 shared papers)Jia Ye (3 shared papers)Naiyao Zhang (1 shared paper)
- Journals
- IEEE Electron Device Letters (6 papers)Energy Technology (3 papers)Experimental Thermal and Fluid Science (2 papers)Applied Physics Letters (2 papers)Materials Science and Engineering R Reports (2 papers)
- Partner nations
- United StatesChinaFinland
In The Last Decade
Ke Zeng
73 papers receiving 4.3k citations
Ke Zeng's Hit Papers
Peers
Comparison fields: 5 of 88
- General Materials Science 247
- Electronic, Optical and Magnetic Materials 1.3k
- Mechanical Engineering 2.2k
- Electrical and Electronic Engineering 2.6k
- Materials Chemistry 1.5k
Countries citing papers authored by Ke Zeng
This map shows the geographic impact of Ke Zeng's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Ke Zeng with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Ke Zeng more than expected).
Fields of papers citing papers by Ke Zeng
This network shows the impact of papers produced by Ke Zeng. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Ke Zeng. The network helps show where Ke Zeng may publish in the future.
Co-authors
The 25 scholars most cited alongside Ke Zeng, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.
All Works
Showing the 20 most-cited of 75 papers — load more, or switch the sort, to bring in the rest.
| # | Work | ||
|---|---|---|---|
| 1 | Six cases of reliability study of Pb-free solder joints in electronic packaging technology Hit paper breakdown → | 2002 | 1168 |
| 2 | Tin–lead (SnPb) solder reaction in flip chip technology Hit paper breakdown → | 2001 | 499 |
| 3 | 2002 | 227 | |
| 4 | 2018 | 196 | |
| 5 | 2020 | 188 | |
| 6 | 2000 | 148 | |
| 7 | 1999 | 127 | |
| 8 | 2019 | 114 | |
| 9 | 2017 | 112 | |
| 10 | 1994 | 110 | |
| 11 | 2001 | 107 | |
| 12 | 2016 | 98 | |
| 13 | 2015 | 82 | |
| 14 | 1999 | 82 | |
| 15 | 2002 | 78 | |
| 16 | 2023 | 69 | |
| 17 | 2019 | 64 | |
| 18 | 1999 | 64 | |
| 19 | 2019 | 61 | |
| 20 | 2017 | 57 |
About Ke Zeng
Ke Zeng is a scholar working on Electrical and Electronic Engineering, Electronic, Optical and Magnetic Materials, Materials Chemistry, Mechanical Engineering and General Materials Science, having authored 75 papers that have together received 4.5k indexed citations. Recurring topics across this work include Ga2O3 and related materials (19 papers), Electronic Packaging and Soldering Technologies (15 papers), ZnO doping and properties (14 papers), Intermetallics and Advanced Alloy Properties (12 papers), Electronic and Structural Properties of Oxides (12 papers), Metallurgical and Alloy Processes (11 papers), GaN-based semiconductor devices and materials (9 papers) and Semiconductor materials and devices (8 papers). The work is most often cited by research in General Materials Science (247 citations), Electronic, Optical and Magnetic Materials (1.3k citations), Mechanical Engineering (2.2k citations), Electrical and Electronic Engineering (2.6k citations) and Materials Chemistry (1.5k citations). Ke Zeng has collaborated with scholars based in United States, China and Finland. Frequent co-authors include K. N. Tu, K. N. Tu, Uttam Singisetti, Marko Hämäläinen, J.K. Kivilahti, Abhishek Vaidya, Jia Ye, Naiyao Zhang, Wenli Xu and Shivam Sharma. Their work appears in journals such as IEEE Electron Device Letters, Energy Technology, Experimental Thermal and Fluid Science, Applied Physics Letters and Materials Science and Engineering R Reports.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.