D.F. Baldwin
Impact in
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- Manufacturing Process and Optimization
- Flexible and Reconfigurable Manufacturing Systems
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- Product Development and Customization
Papers in
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- Electronic Packaging and Soldering Technologies 69
- 3D IC and TSV technologies 64
- Integrated Circuits and Semiconductor Failure Analysis 8
- Electrostatic Discharge in Electronics 7
- Advancements in Photolithography Techniques 6
- Advanced MEMS and NEMS Technologies 6
- Co-authors
- Thomas L. De Fazio (2 shared papers)Daniel E. Whitney (2 shared papers)Chun‐Ho Kim (10 shared papers)Nam P. Suh (1 shared paper)C.P. Wong (9 shared papers)Derek J. Milner (3 shared papers)Rao Tummala (6 shared papers)Fuhan Liu (2 shared papers)
- Journals
- IEEE Transactions on Electronics Packaging Manufacturing (13 papers)IEEE Transactions on Advanced Packaging (3 papers)IEEE Transactions on Components and Packaging Technologies (3 papers)Journal of Electronic Packaging (2 papers)IEEE Transactions on Robotics and Automation (1 paper)
- Partner nations
- United StatesSwedenGermany
In The Last Decade
D.F. Baldwin
77 papers receiving 853 citations
Peers
Comparison fields: 5 of 60
- Industrial and Manufacturing Engineering 306
- Management of Technology and Innovation 85
- Electrical and Electronic Engineering 498
- Polymers and Plastics 104
- Automotive Engineering 90
Countries citing papers authored by D.F. Baldwin
This map shows the geographic impact of D.F. Baldwin's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by D.F. Baldwin with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites D.F. Baldwin more than expected).
Fields of papers citing papers by D.F. Baldwin
This network shows the impact of papers produced by D.F. Baldwin. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by D.F. Baldwin. The network helps show where D.F. Baldwin may publish in the future.
Co-authors
The 25 scholars most cited alongside D.F. Baldwin, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.
All Works
Showing the 20 most-cited of 87 papers — load more, or switch the sort, to bring in the rest.
| # | Work | ||
|---|---|---|---|
| 1 | 1991 | 293 | |
| 2 | 1995 | 89 | |
| 3 | 2003 | 51 | |
| 4 | 1999 | 43 | |
| 5 | 2002 | 36 | |
| 6 | 2001 | 21 | |
| 7 | 2001 | 17 | |
| 8 | 2002 | 16 | |
| 9 | 2002 | 15 | |
| 10 | 2003 | 15 | |
| 11 | 2000 | 13 | |
| 12 | 1999 | 12 | |
| 13 | 2005 | 12 | |
| 14 | 2000 | 11 | |
| 15 | 2023 | 10 | |
| 16 | 2002 | 10 | |
| 17 | 2002 | 10 | |
| 18 | 2003 | 10 | |
| 19 | 2002 | 9 | |
| 20 | 2002 | 9 |
About D.F. Baldwin
D.F. Baldwin is a scholar working on Electrical and Electronic Engineering, Mechanics of Materials, Mechanical Engineering, Automotive Engineering and Industrial and Manufacturing Engineering, having authored 87 papers that have together received 932 indexed citations. Recurring topics across this work include Electronic Packaging and Soldering Technologies (69 papers), 3D IC and TSV technologies (64 papers), Integrated Circuits and Semiconductor Failure Analysis (8 papers), Additive Manufacturing and 3D Printing Technologies (8 papers), Electrostatic Discharge in Electronics (7 papers), Advancements in Photolithography Techniques (6 papers), Advanced MEMS and NEMS Technologies (6 papers) and Manufacturing Process and Optimization (5 papers). The work is most often cited by research in Industrial and Manufacturing Engineering (306 citations), Management of Technology and Innovation (85 citations), Electrical and Electronic Engineering (498 citations), Polymers and Plastics (104 citations) and Automotive Engineering (90 citations). D.F. Baldwin has collaborated with scholars based in United States, Sweden and Germany. Frequent co-authors include Thomas L. De Fazio, Daniel E. Whitney, Chun‐Ho Kim, Nam P. Suh, C.P. Wong, Derek J. Milner, Rao Tummala, Fuhan Liu, G. Edward White and V. Sundaram. Their work appears in journals such as IEEE Transactions on Electronics Packaging Manufacturing, IEEE Transactions on Advanced Packaging, IEEE Transactions on Components and Packaging Technologies, Journal of Electronic Packaging and IEEE Transactions on Robotics and Automation.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.