Yi-Wun Wang

28 papers and 605 indexed citations i.

Yi-Wun Wang has authored 28 papers that have received a total of 605 indexed citations. This includes 27 papers in Electrical and Electronic Engineering, 17 papers in Mechanical Engineering and 4 papers in Electronic, Optical and Magnetic Materials. The topics of these papers are Electronic Packaging and Soldering Technologies (26 papers), 3D IC and TSV technologies (22 papers) and Advanced Welding Techniques Analysis (12 papers). Yi-Wun Wang is often cited by papers focused on Electronic Packaging and Soldering Technologies (26 papers), 3D IC and TSV technologies (22 papers) and Advanced Welding Techniques Analysis (12 papers) and collaborates with scholars based in Taiwan and Japan. Yi-Wun Wang's co-authors include C. R. Kao, Yan‐Cheng Lin, Chia-Wei Chang, Haiyang Yu and Shenghao Yang and has published in prestigious journals such as Journal of The Electrochemical Society, Materials Science and Engineering A and Journal of Alloys and Compounds.