King-Ning Tu
Impact in
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- Copper Interconnects and Reliability
- General Materials Science top 10%
Papers in
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- Electronic Packaging and Soldering Technologies 3
- Integrated Circuits and Semiconductor Failure Analysis 2
- Silicon and Solar Cell Technologies 2
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- Metal and Thin Film Mechanics 1
- Co-authors
- S.A. Gee (1 shared paper)Chih Chen (1 shared paper)Yingxia Liu (1 shared paper)Jianing Li (1 shared paper)Yifan Yao (1 shared paper)Tzu-Wen Lin (1 shared paper)Kai-Cheng Shie (1 shared paper)Qinglei Sun (2 shared papers)
- Journals
- Applied Surface Science (1 paper)Nanomaterials (1 paper)Springer series in materials science (1 paper)CERN Document Server (European Organization for Nuclear Research) (1 paper)Cambridge University Press eBooks (1 paper)
- Partner nations
- United StatesHong KongChina
In The Last Decade
King-Ning Tu
7 papers receiving 351 citations
Peers
Comparison fields: 5 of 26
- Electronic, Optical and Magnetic Materials 114
- General Materials Science 18
- Electrical and Electronic Engineering 324
- Mechanical Engineering 141
- Aerospace Engineering 32
Countries citing papers authored by King-Ning Tu
This map shows the geographic impact of King-Ning Tu's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by King-Ning Tu with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites King-Ning Tu more than expected).
Fields of papers citing papers by King-Ning Tu
This network shows the impact of papers produced by King-Ning Tu. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by King-Ning Tu. The network helps show where King-Ning Tu may publish in the future.
Co-authors
The 10 scholars most cited alongside King-Ning Tu, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.
All Works
| # | Work | ||
|---|---|---|---|
| 1 | 2007 | 162 | |
| 2 | 2007 | 152 | |
| 3 | 2005 | 36 | |
| 4 | 2025 | 7 | |
| 5 | 2020 | 2 | |
| 6 | 2025 | 1 | |
| 7 | 2010 | 1 |
About King-Ning Tu
King-Ning Tu is a scholar working on Electrical and Electronic Engineering, Mechanics of Materials, Electronic, Optical and Magnetic Materials, Materials Chemistry and Atomic and Molecular Physics, and Optics, having authored 7 papers that have together received 361 indexed citations. Recurring topics across this work include Electronic Packaging and Soldering Technologies (3 papers), Integrated Circuits and Semiconductor Failure Analysis (2 papers), Silicon and Solar Cell Technologies (2 papers), Copper Interconnects and Reliability (2 papers), Minerals Flotation and Separation Techniques (1 paper), Advanced materials and composites (1 paper), Metal and Thin Film Mechanics (1 paper) and Semiconductor materials and interfaces (1 paper). The work is most often cited by research in Electronic, Optical and Magnetic Materials (114 citations), General Materials Science (18 citations), Electrical and Electronic Engineering (324 citations), Mechanical Engineering (141 citations) and Aerospace Engineering (32 citations). King-Ning Tu has collaborated with scholars based in United States, Hong Kong and China. Frequent co-authors include S.A. Gee, Chih Chen, Yingxia Liu, Jianing Li, Yifan Yao, Tzu-Wen Lin, Kai-Cheng Shie, Qinglei Sun, Andriy Gusak and Yifan Yao. Their work appears in journals such as Applied Surface Science, Nanomaterials, Springer series in materials science, CERN Document Server (European Organization for Nuclear Research) and Cambridge University Press eBooks.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.