Brook Chao
Impact in
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- Copper Interconnects and Reliability
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- Electronic Packaging and Soldering Technologies
- 3D IC and TSV technologies
Papers in
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- Electronic Packaging and Soldering Technologies 8
- 3D IC and TSV technologies 5
- Advancements in Photolithography Techniques 3
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- Intermetallics and Advanced Alloy Properties 4
- Co-authors
- Paul S. Ho (9 shared papers)Seung‐Hyun Chae (5 shared papers)Jay Im (4 shared papers)Kuan-Hsun Lu (2 shared papers)Xuefeng Zhang (4 shared papers)Xuefeng Zhang (1 shared paper)Min Ding (3 shared papers)Peng Su (2 shared papers)
- Journals
- Journal of Applied Physics (2 papers)Microelectronics Reliability (1 paper)Acta Materialia (1 paper)Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE (3 papers)
- Partner nations
- United StatesGermanyChina
In The Last Decade
Brook Chao
12 papers receiving 441 citations
Peers
Comparison fields: 5 of 22
- Electronic, Optical and Magnetic Materials 171
- Electrical and Electronic Engineering 434
- Mechanical Engineering 204
- General Materials Science 15
- Aerospace Engineering 48
Countries citing papers authored by Brook Chao
This map shows the geographic impact of Brook Chao's research. It shows the number of citations coming from papers published by authors working in each country. You can also color the map by specialization and compare the number of citations received by Brook Chao with the expected number of citations based on a country's size and research output (numbers larger than one mean the country cites Brook Chao more than expected).
Fields of papers citing papers by Brook Chao
This network shows the impact of papers produced by Brook Chao. Nodes represent research fields, and links connect fields that are likely to share authors. Colored nodes show fields that tend to cite the papers produced by Brook Chao. The network helps show where Brook Chao may publish in the future.
Co-authors
The 25 scholars most cited alongside Brook Chao, linked wherever they have co-authored with each other. Click a name or a connecting line to browse the papers they share.
All Works
| # | Work | ||
|---|---|---|---|
| 1 | 2007 | 175 | |
| 2 | 2006 | 97 | |
| 3 | 2006 | 70 | |
| 4 | 2009 | 64 | |
| 5 | 2005 | 17 | |
| 6 | 2008 | 10 | |
| 7 | 2007 | 7 | |
| 8 | 2007 | 6 | |
| 9 | 2008 | 6 | |
| 10 | 2007 | 3 | |
| 11 | 2007 | 1 | |
| 12 | 2008 | 1 |
About Brook Chao
Brook Chao is a scholar working on Electrical and Electronic Engineering, Mechanical Engineering, Electronic, Optical and Magnetic Materials, Biomedical Engineering and Aerospace Engineering, having authored 12 papers that have together received 457 indexed citations. Recurring topics across this work include Electronic Packaging and Soldering Technologies (8 papers), 3D IC and TSV technologies (5 papers), Intermetallics and Advanced Alloy Properties (4 papers), Nanofabrication and Lithography Techniques (3 papers), Advancements in Photolithography Techniques (3 papers), Copper Interconnects and Reliability (3 papers), Aluminum Alloy Microstructure Properties (2 papers) and Advanced Surface Polishing Techniques (2 papers). The work is most often cited by research in Electronic, Optical and Magnetic Materials (171 citations), Electrical and Electronic Engineering (434 citations), Mechanical Engineering (204 citations), General Materials Science (15 citations) and Aerospace Engineering (48 citations). Brook Chao has collaborated with scholars based in United States, Germany and China. Frequent co-authors include Paul S. Ho, Seung‐Hyun Chae, Jay Im, Kuan-Hsun Lu, Xuefeng Zhang, Xuefeng Zhang, Min Ding, Peng Su, Guotao Wang and Guotao Wang. Their work appears in journals such as Journal of Applied Physics, Microelectronics Reliability, Acta Materialia and Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE.
Rankless uses publication and citation data sourced from OpenAlex, an open and comprehensive bibliographic database. While OpenAlex provides broad and valuable coverage of the global research landscape, it—like all bibliographic datasets—has inherent limitations. These include incomplete records, variations in author disambiguation, differences in journal indexing, and delays in data updates. As a result, some metrics and network relationships displayed in Rankless may not fully capture the entirety of a scholar's output or impact.